To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Pixablasters video LED controller can help the DIY lovers, signage professionals and developers to turn a bunch of addressable RGB LED strips into immense video LED display even if they only have a minimum technical skills. The FPGA- based LED controller helps to attain a new level of professional grade digital signage because of its ability to be curved and glued to…
Mouser Electronics is now stocking the BL654PA (Power Amplified) module from Laird Connectivity. The FCC, IC, RCM, KC, and Bluetooth® SIG-certified module allows engineers to implement single-mode Bluetooth 5 and Thread (802.15.4) technology into simple Bluetooth Low Energy designs.
The Laird BL654PA module…
Renesas Electronics Corporation, unveiled the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers(MCUs) that can deliver the ultimate combination of optimized performance, security, connectivity, peripheral IP, and easy-to-use Flexible Software Package (FSP) to address the next generation of embedded solutions with the help of a comprehensive partner…
Sid Price, an embedded software design service company has launched a campaign on Wireless debug probe for ARM Coretex-M Microprocessors called ctxLink. The ctxLink is an open hardware, open firm ware , Black Magic Probe (BMP) based Debugging Probe that supports Wi-Fi connectivity and battery powered operations. By implementing SWD and JTAG interface it…
Infineon Technologies developed the NFC-PWM series (NLM0011 & NLM0010) for fast and cost effective implementation of NFC programming for LED drivers. The NFC programming can replace the labor intensive “plug-in resistor” current setting method with the contact less NFC interface. It improves the operational efficiency and flexibility in value chain by implementing…
Vishay Intertechnology introduced a new series of Infrared (IR) sensor modules in five compact package types. These TSSP9xxx modules offer a long range presence and proximity sensing up to 2 m and 30 m with a fast reaction time of 300 μs and a high interface time without spurious signals. These modules are designed with a PIN photodiode and sensor IC in compact Minimold…
The Renesas Electronics Corporation announced the joint development of a deep learning-based object recognition solution for smart cameras used in next-generation advanced driver assistance system applications and cameras for ADAS level 2 and above. This new smart camera solution employs deep learning for object recognition with high precision and low power consumption; it…
Researchers at Low Energy Electronic Systems (LEES), Singapore-MIT Alliance for Research and Technology (SMART), have successfully developed a new type of semiconductor chip that can be developed in a more commercially viable way compared to existing methods. While the semiconductor chip is among the most manufactured device in history, it is getting more and…
STMicroelectronics introduced the industry’s highest-performing Arm® Cortex®-M general-purpose MCU- STM32H7, combining dual-core punch with power-saving features and enhanced cyber protection. The new devices leverage a 480MHz version of the Cortex-M7, the highest performing member of Arm’s Cortex-M family, and add a 240MHz Cortex-M4 core. With ST’s smart architecture,…
Silicon Labs have launched a new portfolio of highly integrated secure wireless Gecko modules that reduce development cost and complexity. This made it easier to add robust mesh networking connectivity to a wide range of Internet of Things (IoT) products. The new MGM210x and BGM210x Series 2 modules support leading mesh protocols (Zigbee®, Thread, and Bluetooth®…
Vishay Intertechnology introduced new 200 V Fred Pt Ultrafast recovery rectifiers in the eSMP® series MicroSMP (DO-219AD) package, offering a current rating to 2 A. Measuring 2.5 mm by 1.3 mm with a low 0.65 mm profile, the 1 A VS-1EQH02HM3 and 2 A VS-2EQH02HM3 provide space-saving alternatives to rectifiers in the SMA. Also available are…
AAEON announced the release of the new AI @Edge Box PCs, the BOXER-8300AI Series, which can offer AI @Edge Solutions using Intel Movidius Myriad X VPU. This series includes the BOXER-8310AI, BOXER- 8320AI and the BOXER-8330AI that can power AI and edge computing. The core of the BOXER-8300AI series consists of the AI Core X module from AAEON featuring the Intel Movidius…
