To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
The Space CSAC-SA65 combines atomic-clock accuracy with built-in 1 PPS disciplining and low-power consumption
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MALVERN, Pa. — Aug. 11, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AC line rated…
Espressif Systems has officially started mass production of its new ESP32-S31 wireless microcontroller, making it available to developers and…
Munich, Germany – 15 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the RIC70115, a radiation-hardened (rad hard)…
Hsinchu, Taiwan– June 30, 2026 – Nuvoton Technology Corporation, a leading global semiconductor provider, …
MALVERN, Pa. — June 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first four devices in its…
ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which…
GREENSBORO, N.C., June 9, 2026 – Qorvo ® (Nasdaq: QRVO), a leading global provider of connectivity and power…
GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new…
Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-…
GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new…
CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules,…
