To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
As appliance and equipment manufacturers look for ways to reduce system costs, many are replacing displays with Human Machine Interfaces (HMIs) using high-end decoration and illuminated capacitive-touch buttons, sliders and wheels. These interfaces often require a large number of touch sensors which can increase acquisition time and reduce the signal-to-noise ratio (SNR) when using…
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has expanded its GaN portfolio into low-voltage applications with its first family of 100V enhancement mode (E-mode) GaN-based discrete power transistors. The RTP100E005G1FL, RTP100E2P6G1FL, RTP100E1P8G1FL-DSC and RTP100E1P2G1FL-DSC low-voltage GaN FETs deliver ultra-fast switching speeds and…
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new power modules featuring 650 V superjunction MOSFETs in the industry-standard SOT-227 package. Designed to deliver an optimized balance between conduction and switching losses, the Vishay Semiconductors VS-FC50SA65, VS-FC100SA65, VS-FC150SA65, and VS-FC50LA65 support high efficiency power conversion in industrial applications.…
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155mm × 1.155mm and combines an ultra-small footprint with multi-time programmability, enabling designers to reduce board…
As automotive, AI/data center, networking and industrial systems quickly migrate toward 48V power architectures to improve efficiency and support higher power demands, designers need more than visibility into instantaneous voltage and current conditions. They need systems that understand energy use over time and can respond intelligently to changing power conditions. Microchip Technology (…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of its PSOC™ Control C3 Performance Line microcontroller family to enable real-time control for power and motor applications. The new family of microcontrollers (MCUs) offers best-in-class performance through high control loop frequency, accuracy and system efficiency. Based on Arm® Cortex®-M33 multi-core…
The demand for low-voltage clock drivers continues to grow with the rapid adoption of advanced FinFET process nodes used in high-performance FPGAs, SoCs, AI accelerators and next-generation CPUs. Printed circuit board designers face increasing challenges due to the limited availability of standard 1.2V LVCMOS clock buffers and level-translating buffers capable of…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation AI accelerators and vertical power delivery modules. Integrating Infineon's OptiMOS™ 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package…
Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of thin film chip resistors in compact 0402 and 0603 case sizes. Built on an advanced aluminum nitride (AlN) substrate, the Vishay Sfernice CHEP series combines exceptional power handling and high frequency performance in standard surface-mount footprints, allowing designers to achieve higher…
CAMARILLO, Calif. Aug 19- Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, today announced the expansion of its LoRa Plus family with the introduction of the LR2022 and LR2012 transceivers, both now available in…
Arduino has opened pre-orders for the VENTUNO Q, a new edge-AI development platform built around Qualcomm’s Dragonwing IQ8 processor. The board is aimed at developers building robotics, computer vision, industrial automation and other systems where AI needs to interact with the physical world. According to Ankit Singh, Arduino’s India lead, the introductory pricing…
TDK Corporation (TSE:6762) today announced the launch of the TDK SensEI edgeRX PRO, a new high-performance sensor node that expands its predictive maintenance platform, edgeRX.
edgeRX PRO integrates vibration, acoustic, magnetic, temperature, and rotational motion sensing, leveraging an integrated 6-axis IMU and edge AI processing in…
