To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-Package (SiP), the ICE188LM, ICE189LM, and ICE180LM, extending the supported output power range and helping white goods manufacturers comply with increasingly stringent EU energy efficiency and standby power regulations. The CoolSET SiP integrates a high-…
GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to simplify multi-band radio architectures. Spanning 50 MHz to 10 GHz, the family reduces component count, improves signal integrity and enables more efficient RF system design across 5G infrastructure, industrial, drone and…
CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high‑voltage power applications. The new modules integrate 3.3 kV silicon carbide (SiC) mSiC® MOSFETs and Schottky diodes in an…
Munich, Germany – 20 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones,…
CHANDLER, Ariz., April 28, 2026 — As the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology (Nasdaq: MCHP) is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller. The devices are designed to help system architects address emerging cybersecurity mandates,…
ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness…
Nordic Semiconductor launched its nRF54L Series in April 2023 as a wireless platform for IoT devices. Now, the company is expanding the same nRF54L series with the launch of two new entry-level Bluetooth LE SoCs - the nRF54LS05A and the nRF54LS05B, targeting cost-sensitive IoT applications. This launch was announced at the Embedded World 2026 on March 9. These ultra-low-power chips are…
STMicroelectronics has introduced its latest entry-level microcontroller family, the STM32C5 series, aimed at powering the next generation of smart devices across homes, industries, and infrastructure. Built around the Arm Cortex-M33 and manufactured using an advanced 40nm process, the new series delivers a significant boost in performance, memory capacity, and efficiency compared to…
As the global transition toward industrial automation and smart living accelerates, the security and processing efficiency of microcontrollers (MCUs) have become decisive factors for enterprises to succeed in the business-to-business market. Nuvoton Technology, a leading provider of microcontrollers, proudly announces the launch of its new NuMicro® M3331 series 32-bit microcontroller.…
Delivering 440 W of power typically requires sophisticated resonant topologies, but Power Integrations (PI) has changed that with its TOPSwitchGaN flyback IC family, based on its PowiGaN tech and TOPSwitch architecture. These ICs featuring 800 V PowiGaN switches make designing circuits easier for engineers and often remove the need for a heat sink through cooler operation. Gallium…
Alibaba has introduced the XuanTie C950, a high-performance 64-bit RISC-V processor core designed for demanding workloads such as edge AI, cloud computing, and high-performance systems. Built on the RVA23 profile, the C950 features a superscalar, out-of-order microarchitecture with up to 8 cores per cluster and clock speeds reaching 3.2 GHz. With a performance score exceeding 22 SPECint2006…
Arm has introduced the AGI CPU, its first internally developed data center processor, marking a transition from its long-standing IP licensing model to delivering complete silicon solutions for cloud infrastructure. The launch is closely aligned with the growing demands of artificial intelligence workloads, particularly those requiring sustained, multi-step computation rather than traditional…
