To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
TDK Corporation (TSE:6762) announces the introduction of the TDK-Lambda DDSM 120 W and 240 W programmable DC-DC converters. These products feature a wide input and output voltage range with an isolated design. The DDSM series also offers remote control and real time monitoring via Modbus over USB using the PowerCMC control and monitoring center. In addition, a…
The Space CSAC-SA65 combines atomic-clock accuracy with built-in 1 PPS disciplining and low-power consumption
CHANDLER, Ariz., Aug. 13, 2026 (GLOBE NEWSWIRE) -- The growing New Space market is fueling demand for smaller, less expensive space hardware to support short-duration missions for applications such as satellite-to-cellular…
MALVERN, Pa. — Aug. 11, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AC line rated ceramic disc safety capacitors with a Y1 rating of 300 VAC and 1500 VDC in a surface-mount casing. Designed for EMI / RFI suppression and filtering in industrial environments, the Vishay BCcomponents SMDY1…S series reduces board space requirements by…
Espressif Systems has officially started mass production of its new ESP32-S31 wireless microcontroller, making it available to developers and manufacturers worldwide. The latest addition to the ESP32 family is built for demanding AIoT applications, combining faster processing, modern wireless standards, and multimedia support in a single chip. With production now underway, the ESP32-S31 is…
Munich, Germany – 15 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the RIC70115, a radiation-hardened (rad hard) gallium nitride (GaN) high-electron mobility transistor (HEMT) driver designed for satellite and high-reliability space applications where power conversion performance and long-term operational integrity are critical requirements. The RIC70115 supports…
Hsinchu, Taiwan– June 30, 2026 – Nuvoton Technology Corporation, a leading global semiconductor provider, has announced the launch of the NSC128L42, a new 32-bit Arm® Cortex®-M23 microcontroller designed for high-precision measurement. This highly integrated solution combines a 24-bit Sigma-Delta ADC, an LCD driver, and high-quality voice synthesis in a…
MALVERN, Pa. — June 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first four devices in its new IHDV line of high voltage power inductors for next-generation automotive, energy, and industrial systems. Engineered for designs requiring 1.5 kV isolation voltages, and available in compact 0808 (20 mm x 14 mm x 14 mm) and 1008 (25 mm x 20 mm x…
ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications.
In the automotive sector, power demand is increasing, particularly in high-end vehicle models. 48V power supply systems are gaining attention as a highly…
GREENSBORO, N.C., June 9, 2026 – Qorvo ® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today introduced an X-band radar front- end solution that enables defense system designers to achieve higher performance without increasing size, weight or prime power. Designed for modern phased array and multifunction sensors, the…
GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators (DSAs) designed for defense, aerospace and infrastructure customers. This new portfolio simplifies RF system design, reduces BOM complexity and accelerates integration in…
Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-Package (SiP), the ICE188LM, ICE189LM, and ICE180LM, extending the supported output power range and helping white goods manufacturers comply with increasingly stringent EU energy efficiency and standby power regulations. The CoolSET SiP integrates a high-…
GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new family of RF switches designed to simplify multi-band radio architectures. Spanning 50 MHz to 10 GHz, the family reduces component count, improves signal integrity and enables more efficient RF system design across 5G infrastructure, industrial, drone and…
