To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
CHANDLER, Ariz., February 3, 2026 — The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and scalability. Integrated power modules help streamline design, reduce energy use and deliver the stable performance required for advanced data centers. Microchip Technology (Nasdaq: MCHP) today announces the launch of the MCPF1525 Power…
ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.
In recent years, electronic devices have demanded…
Munich, Germany – 20 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing the EZ-USB™ FX2G3, a next-generation USB 2.0 peripheral controller designed to deliver superior performance, robust security, and advanced power efficiency for USB devices. This new controller builds on the trusted EZ-USB™ FX2LP platform and offers a highly adaptable solution for industries…
CHANDLER, Ariz., January 13, 2026 — Microchip Technology (Nasdaq: MCHP) today announces the release of its JANPTX family of non-hermetic plastic Transient Voltage Suppressor (TVS) devices that meet the MIL-PRF-19500 qualification, offering high-reliability protection for aerospace and defense applications. These TVS devices are the first in the industry to achieve MIL-PRF-19500 qualification…
Las Vegas, United States, 7 January 2026 – Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise 5 (X5M) chip platform and with an integrated Ubuntu operating system, the module features up to 10 TOPs of brain processing units (BPU) computing…
Munich, Germany – 02 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Flex take the next step in their collaboration to accelerate the development of software-defined vehicles (SDVs). At CES 2026, they will launch a Zone Controller Development Kit—a modular design for Zone Control Units (ZCU) engineered to fast track the development of SDV-ready E/E architectures. The new…
Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announces an expansion of its automotive-compliant* bipolar transistor portfolio with the introduction of the DXTN/P 78Q & 80Q series. These ultra-low VCE(sat) NPN and PNP transistors deliver industry-leading conduction efficiency and thermal performance, optimized for demanding automotive power switching and control.
The twelve high…
India has marked an important step in its semiconductor roadmap with the launch of DHRUV64, the country’s first fully indigenous 1.0 GHz, 64-bit dual-core microprocessor. Developed by the Centre for Development of Advanced Computing (C-DAC) under the Microprocessor Development Programme, DHRUV64 is designed to serve both strategic and commercial needs. The processor is part of India’s broader…
Quarky Intellio is a LEGO-compatible AI module made for hands-on learning in Artificial Intelligence, Augmented Reality, and Robotics. It is built on the ESP32-S3 microcontroller and includes a camera, microphone, speaker, rechargeable battery, SD card slot, and multiple connection ports. These features allow users to experiment with vision, sound, and basic edge AI projects using a small, all…
AAEON has released the COM-ARHC6, a COM Express Type 6 Computer-on-Module (COM). It features Intel® Core™ Ultra Series 2 processors, offering choices including Intel® Core™ Ultra 9 Processor 285H, Intel® Core™ Ultra 7 Processor 255H, and Intel® Core™ Ultra 5 Processor 225H. As these processors come with an integrated Intel® Arc™ GPU and an Intel® AI Boost NPU, the module is capable of reaching…
STMicroelectronics has introduced a Matter NFC chip, which is a first for the sector. With just a tap, the new ST25DA-C chip allows users to add connected devices to their home network, such as smart lighting, access-control devices, and security cameras. To anyone unfamiliar, Matter is a standard created to allow devices from different brands to talk to each other. With this product,…
ROHM’s new three-phase brushless DC motor gate driver uses its proprietary TriC3™ technology to minimise FET switching loss without compromising on electromagnetic interference (EMI). It is designed for motors that run on 12 to 48V power sources, meaning that applications include electric drills, industrial fans, air conditioners, and E-bikes.
The TriC3™ tech helps mitigate the usual…
