To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Vishay Intertechnology’s new VLMRGB6122 is a high-performance RGB LED designed for automotive lighting, full-color displays, and backlighting applications. It measures just 3.5 mm x 2.8 mm x 1.4 mm and comes in a PLCC-6 surface-mount package. Separate anode and cathode connections for the red, green, and blue chips allow colors to be controlled independently. Precise mixing across the full…
AutoML for Embedded, developed by Analog Devices (ADI) and Antmicro, is available now to help developers easily build, optimize, and deploy AI models on constrained edge hardware. The tool is built into Visual Studio Code as a plugin. It’s part of the Kenning framework. Whether you're working with ADI’s MAX78002 or MAX32690 AI MCUs, or simulating your project using Renode and the Zephyr RTOS,…
To strengthen security in USB tokens and other authentication devices, Infineon has announced a new USB-based security controller, ID Key S USB. It’s the newest addition to the ID Key family, a line of secure hardware devices. It’s a mix of two controllers in a single package: a security controller (Infineon SLC38) for cryptographic operations and a USB controller for device communication.…
Renesas Electronics Corporation has launched a new group of microcontrollers (MCUs) named RA2T1, tailored for systems that control a single motor. The group is based on the Arm Cortex-M23 processor, running at 64 MHz, and is meant for devices like fans, power tools, vacuum cleaners, refrigerators, printers, and hair dryers. They have a 3-channel sample and hold (S&H) function to measure…
Raspberry Pi has announced that Camera Module 3 Sensor Assemblies are now available as standalone products starting at $15. The Camera Module 3 was originally launched approximately 2.5 years ago and is widely used in hobbyist projects, as well as in industrial and embedded applications. These new sensor assemblies stemmed from the need for smaller form factors that were required in some…
A company known for its wireless communication chips, Espressif Systems, has made its official entry into the Wi-Fi 6E market as of July 4, 2025. The Wi-Fi 6E solutions will work together with Espressif's existing multi-core RISC-V technology. Wi-Fi 6E is an extension of the Wi-Fi 6 standard and includes access to the 6 GHz frequency band, which was previously unavailable for public use. The 6…
ROHM has introduced a new 100V power MOSFET called RY7P250BM that’s optimized for hot-swap circuits in 48V power systems that we see in AI servers and industrial power supplies. The product is tailored for AI servers and data centers, where rising power demands from generative AI and high-performance GPUs push systems to adopt more efficient 48V architecture. Hot-swap circuits are circuits…
Vishay Intertechnology has announced an expansion of its CHA series of thin film chip resistors. The resistors, being AEC-Q200 qualified, meet strict automotive reliability standards. The initial launch was in a 02016 case size, supporting up to 70 GHz, and the currently introduced model is in a 0402 case size.
Though the frequency performance goes slightly down from up to 70GHz to…
Murata has introduced a 3-axis accelerometer called the SCA3400-D01. It is designed for use in structural health monitoring, machine control, inertial measurement units, construction tools and systems, tilt sensing, levelling & platform stabilization, and positioning & guidance systems. 3-axis sensing means measuring motion or tilt in X, Y, and Z directions.
The ultra-low noise…
Infineon has introduced its radiation-tolerant memory portfolio. These are important for space use, specifically in Low Earth Orbit (LEO) missions. LEO satellites are closer to Earth, where the severity of radiation is less, and hence these COTS components offer cost-effective and time-efficient solutions.
The current release includes three types of memory chips: F-RAM (Ferroelectric…
RAKwireless has launched the RAK11160 WisDuo Module. This dual-core IoT module combines two microcontrollers: an STM32WLE5 for LoRaWAN-based long-range wireless communication and an ESP32-C2 for Wi-Fi and Bluetooth Low Energy connectivity.
The ESP32 can enter a deep power-off mode using only ~1 µA. This makes it great for remote farming sensors, moving vehicles, forests, and even asset…
Broadcom Inc. has introduced Tomahawk 6, the world’s first 102.4 Terabits per second Ethernet switch chip, and it’s already started shipping. This new chip is designed for large-scale AI training and inference clusters, providing the highest bandwidth and performance that can be packed in a piece of silicon.
The Tomahawk 6 is twice what its predecessors were in terms of switching…
