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DigiKey and Arduino Host Prototyping Webinar THIEF RIVER FALLS, Minn., USA – DigiKey, the global distribution leader of electronic components and automation products, announces an upcoming webinar, “From board to build: Using UNO Q and App Lab,” which will take place Feb. 12, 2026, at 9 a.m. CST. The webinar, sponsored by Arduino, will explore how Arduino’s UNO Q and App Lab work together to accelerate prototyping, enable… |
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ASML Equipment to Be Part of India’s Upcoming Fabrication Facility in Dholera On the 23rd of January 2026, Ashwini Vaishnaw, Union Minister for Electronics and Information Technology, visited the headquarters of Dutch lithography systems provider ASML in Veldhoven. He said, “Our fab in Dholera will be using ASML equipment. So I have come here to visit and understand their technology.” ASML supplies technology to the semiconductor industry that is used to… |
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L&T Semiconductor and Andes Technology Enter Long-Term RISC-V Collaboration L&T Semiconductor Technologies (LTSCT) announced an IP License Master Agreement with Andes Technology, a RISC-V processor IP provider. The agreement outlines financials, modification rights, and the legal boundaries around confidentiality and tech support. The companies are set up for long-term collaboration, which will allow LTSCT to bring custom-engineered semiconductor solutions to… |
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Silanna Semiconductor, Avnet Forge Strategic Partnership for the Americas Silanna Semiconductor entered a strategic franchise partnership with Avnet, which will offer both technical design support and go-to-market assistance. The collaboration is in effect in the Americas and applies across the entire Silanna Semiconductor product portfolio, including the Plural 10- to 16-bit analog-to-digital converters (ADCs) and the FirePower ultra-efficient laser drivers. … |
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NVIDIA Targets About 90% Reduction in Token Generation Costs With Rubin Platform At CES 2026, Nvidia CEO Jensen Huang presented Rubin, the company’s first “extreme-codesigned” AI platform. The new platform should reduce token-generation costs by roughly 90% versus its previous platform. This Blackwell successor, now in production, is named after astronomer Vera Rubin. The platform includes Rubin GPUs capable of 50 petaflops of NVFP4 inference, Vera CPUs designed for… |
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ROHM and Tata Electronics Form Semiconductor Manufacturing Alliance ROHM and Tata Electronics have announced the formation of a strategic partnership for semiconductor manufacturing. Initially, the broader emphasis will be on implementing a manufacturing framework for power semiconductors. While the partnership takes form in India, the companies aim to serve both Indian and global markets through it. Eyeing mass production by next year, the first plan… |
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Cyient Semiconductors Announces Agreement to Acquire Controlling Stake in Kinetic Technologies Cyient Semiconductors has entered into an agreement to acquire a controlling stake in Kinetic Technologies. Expected to close in the months ahead, the acquisition can involve a transaction of up to $93 million. The existing leadership and engineering team within Kinetic Technologies will continue operating within their current structure, while synchronizing with Cyient Semiconductors' strategy… |
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Virtusa Enters Semiconductor Sector with SmartSoC Solutions Acquisition Virtusa has announced the acquisition of SmartSoC Solutions, the final piece that completes its full-stack capabilities. The company’s portfolio now covers everything from chip design to cloud applications. The deal adds over 1,400 of SmartSoC’s engineers to Virtusa, bringing deep expertise in VLSI, physical design, and embedded software. This puts Virtusa in a position to tap into the… |
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SFO Technologies to Set Up Greenfield Electronics Facility in Theni, Tamil Nadu NeST Group’s flagship company, SFO Technologies, exchanged a memorandum of understanding (MoU) with the Tamil Nadu government at the TN Rising Conclave in Madurai. The MoU is for its plans to establish a greenfield electronics manufacturing facility in Theni, Tamil Nadu. The exchange happened in the presence of Chief Minister M.K. Stalin and Industries Minister Dr T.R.B. Rajaa. The… |
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Suchi Semicon's New QFN and Power Package Families to Reduce India's Dependency on External Suppliers Suchi Semicon announced the addition of new QFN (Quad Flat No-lead) and Power Package families to its portfolio. The QFN types include QFN, uQFN, DFN, and XFN options, whereas the Power Package types comprise DPAK, TO-series and IPAK options. This move helps avoid dependency on external suppliers by satisfying the package requirements of Indian chip designers and product manufacturers in-house… |
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Building a Humanoid Robot? Join DigiKey and Hirose for an Informational Webinar on Humanoid Robotics DigiKey, the leading global electronic components and automation products distributor, is offering a free webinar with supplier Hirose about humanoid robotics on Dec. 10 at 10 a.m. CST. The one-hour virtual event will cover design priorities, common pitfalls and connector solutions that are enabling the latest advancements in humanoid robotics. The global humanoid robot market is… |
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India Democratizes Chip Fabrication With 5 MPW Runs Over the Past 12 Months At a handover ceremony during his visit to the Semi-Conductor Laboratory (SCL), Mohali, for a review, Ashwini Vaishnaw, Union Minister for Electronics & Information Technology, delivered 28 chips designed by students from 17 academic institutions. The fabricated chips included 600 bare dies and 600 packaged chips. This was made possible by the Chips to Start-up (C2S) Programme. A… |
