Suchi Semicon announced the addition of new QFN (Quad Flat No-lead) and Power Package families to its portfolio. The QFN types include QFN, uQFN, DFN, and XFN options, whereas the Power Package types comprise DPAK, TO-series and IPAK options. This move helps avoid dependency on external suppliers by satisfying the package requirements of Indian chip designers and product manufacturers in-house.
The two product lines intend to cater to industries including electric vehicles (EVs), consumer electronics, IoT devices, and solar energy. Their QFN line is ideal for small-form-factor devices where circuit connections are dense. With a zero-delamination process and inspections performed through automation, it features several attachment options. It is compatible with dies cut from ultra-thin wafers and supports wire bonding through fine-pitch gold and copper.
The Power Package family is optimised for the type of devices used in solar inverters and EVs, where they need to withstand high current and high temperatures. It can accommodate SiC dies, with die attach possible using soft solder. Meeting automotive standards, the line features wire bonding through thick aluminium.
“These products have been designed to support everything from everyday electronics to high-power EV and industrial applications. Our focus has been simple: deliver stable performance, robust reliability, and future-ready technology. We believe this launch strengthens our role in India’s semiconductor journey and brings us closer to our vision of becoming a trusted global OSAT partner,” said Ashok Mehta, Founder and MD of Suchi Semicon. Production commenced in January 2025, and the new offerings will be available to customers from January 2026.
