To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
MORNSUN has launched the new 1500W AC/DC enclosed power supply LMF1500-20Bxx series that features universal AC input and at the same time accepts DC input voltage, cost-effective, low no load power consumption, high efficiency, high reliability, and double or reinforced insulation. These converters offer excellent EMC performance and meet IEC/EN/UL62368, EN…
Sensirion has announced a new highly reliable digital temperature sensor series STS4xA that currently consists of two versions: STS41A-AD1B and STS41A-AW1B, with the latter offering optional wettable flank packaging to support automated optical inspection (AOI). This series is based on Sensirion’s CMOSens Technology and the integrated on-chip…
STMicroelectronics has unveiled new microcontrollers designed for the coming electrified drivetrains and domain-oriented, over-the-airupdateable systems that are the foundation of the next generation of EVs. ST’s new Stellar P automotive MCUs are the industry’s first qualifiable devices for model year 2024 vehicles to integrate the new CAN-XL in-…
Toshiba Electronic Devices & Storage Corporation has expanded its lineup of smart gate driver photocouplers with the new TLP5222 which is a 2.5A output smart gate driver photocoupler with a built-in automatic recovery function from the protective operation. This new photocoupler features a wide-rated operating temperature range of between -40°C and 110°…
Renesas Electronics Corporation has announced the development of a new generation of Si-IGBTs which will be offered in a small footprint while providing low power losses. Aimed at next-generation electric vehicle (EVs) inverters, the new AE5-generation IGBTs significantly improve performance and safety as modules by minimizing parameter variations among the…
AAEON has introduced its first autonomous robot controller RBX-I2000 which utilizes hardware-integrated time synchronization to obtain a substantial improvement on existing outdoor autonomous mobile robot technology. Powering its sophisticated mechanism is the 11th Generation Intel Core i7/i5/i3/Celeron Processor SoC, which boasts 4 cores and 8 threads…
Toshiba Electronic Devices & Storage Corporation has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG” which is a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components. This new driver contributes to saving space on circuit boards and…
Massachusetts Institute of Technology (MIT) engineers have developed a new category of wireless wearable skin-like sensors for health monitoring. This new sensor called ‘e-skin’ is an ultrathin semiconductor film made of a piezoelectric substance that adheres to the skin, sensing the vibrations of the body. Moreover, the sensor does not require any power…
Nordic Semiconductor has launched a new ultra-low power, dual-band Wi-Fi 6 companion IC nRF7002 that provides seamless Wi-Fi connectivity and Wi-Fi-based locationing (SSID sniffing of local Wi-Fi hubs) and is designed to be used alongside Nordic’s existing nRF52 and nRF53 Series Bluetooth Systems-on-Chip (SoCs), and nRF91 Series cellular…
STMicroelectronics has released version 4.20 of its TouchGFX user-interface design software which is an advanced, free-of-charge GUI optimized for STM32 microcontrollers and its latest updates include support for ST’s new NeoChrom graphics accelerator, which is integrated into advanced MCUs such as the new STM32U5 series. Developed from ST’s…
Renesas Electronics Corporation has announced the new RZ/N2L microprocessor units (MPUs) for Industrial Ethernet communication that make it easy to add network functionality to industrial equipment and devices. The RZ/N2L complies with many industry-standard specifications and protocols to facilitate the development of industrial automation devices…
Microchip Technology Inc. has expanded its portfolio of MPU System-on-Modules (SOMs) with the new SAM9X60D1G-SOM ARM926EJ-S-based embedded MPU that is available with bare metal or RTOS support through MPLAB Harmony 3 or complete Linux mainlined distributions. This SOM, based on the SAM9X60D1G System in Package (SiP), is a small 28 mm × 28 mm…
