To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Sensirion has introduced the new digital automotive sensor SHT4xA that is based on Sensirion’s CMOSens Technology and meets the most demanding reliability requirements, such as accelerated lifetime tests at 85°C / 85 %RH. Specifically designed for automotive applications, this sensor is available in different accuracy classes with an I2C or pulse…
Infineon Technologies AG has developed the second generation of the REAL3 automotive image sensor IRS2877A, an ISO26262-compliant high-resolution 3D image sensor that comes in a 9 x 9 mm² plastic BGA package and offers a VGA system resolution of 640 x 480 pixels with a tiny image circle of 4 mm. The high resolution of this sensor makes it suitable…
STMicroelectronics has announced two new NFC Forum Reader devices ST25R3916B-AQWT and ST25R3917B-AQWT that support NFC initiator, target, reader, and card-emulation modes and can be used in contactless payment, device-pairing, wireless-charging, brand protection, and other industrial and consumer applications. These new devices introduce improved active…
Microchip Technology Inc. has announced two new PolarFire SoC FPGAs MPFS250T and MPFS025T that deliver a combination of low power consumption, thermal efficiency, and defense-grade security for smart, connected systems. The company has also announced that its Mi-V ecosystem continues to streamline RISC-V adoption while enabling a new class of smaller, more…
onsemi has introduced two complete system solutions that support the most widely used building automation network protocols- Power over Ethernet (PoE) and KNX. Easing the development of access and control panels, the NCN5140S is a System-in-Package (SiP) certified with the KNX Association and along with this, the company has introduced the new…
STMicroelectronics has introduced the new general-purpose low-power dual operational amplifier TSB622 that operates over the extended temperature range -40°C to 125°C and enhances ruggedness and flexibility in industrial and automotive applications. This automotive-qualified amplifier features a broad supply-voltage range from 2.7V to 36V which lets…
Renesas Electronics Corporation has announced the new RZ/T2M motor control microprocessor units that combine fast and highly precise realtime motor control capabilities and industrial Ethernet on a single-chip, while also supporting functional safety operation. By providing all essential peripheral functions for motor control, the RZ/T2M MPU enables…
Texas Instruments has introduced the new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications. These processors also enable dual-screen, full high-…
Renesas Electronics Corporation has introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs). The new ISL78714 CDD software follows ISO26262 ASIL D development processes and is designed to work with the BMS reference design hardware kit, which…
Melexis has introduced a single chip LIN pre-driver MLX81346 that is designed for high power up to 2000 W and enables motor control miniaturization and efficient silent drive with field-oriented control (FOC). This new IC addresses automotive mechatronic applications including oil pumps, engine cooling fans, and BLDC positioning actuators. Moreover, this…
Infineon Technologies AG has launched next-generation XENSIV MEMS microphones IM69D127, IM73A135, and IM72D128 that are designed to capture audio signals with the highest precision and quality and are based on Infineon’s latest Sealed Dual Membrane (SDM) MEMS technology which delivers high ingress protection (IP57) at a microphone level.…
Analog Devices, Inc. has introduced a precision narrow bandwidth signal chain platform that optimizes system performance for signal bandwidths of DC to approximately 10 kHz in industrial and instrumentation applications. This new platform offers a host of complete signal chains with customizable solution options and a curated suite of development tools to…
