To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Espressif Systems has announced the upcoming release of its latest System-on-a-Chip (SoC), the ESP32-P4. This high-performance chip is designed for applications that require strong security, and aims to cater to the next era of embedded applications with a focus on rich Human-Machine Interfaces (…
Renesas Electronics has announced the release of a development kit that includes support for the Matter protocol, an application layer protocol designed to improve interoperability among smart home devices. The kit will support Wi-Fi, Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Thread). Renesas…
Cartken’s robots are backed by AI technology and have the ability to carry two dozen pounds
The US based international ride-hailing company Uber has now proclaimed to unleash a fleet of robots in partnership with the US-based robotics company Cartken. The ride-hailing company, which has recently sold its self-driving car business,…
Infineon Technologies launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The new product family provides significant enhancements on the component level to offer attractive solutions in DC-DC power conversion, opening up new possibilities for system innovation in …
Renesas Electronics Corporation and Fixstars Corporation, today announced the joint development of a suite of tools that allows optimization and fast simulation of software for autonomous driving (AD) systems and advanced driver-assistance systems (ADAS) specifically designed for the R-Car system-on-chip (SoC) devices from Renesas. These tools make it…
The new AP43776Q USB Decoder IC supports USB power delivery (PD) 3.1 standard power range (SPR) and programmable power supply (PPS) as well as Quick Charge™ QC5, fast charging protocols. It also supports legacy battery charging (BC) 1.2 and is highly optimized for multi-port automotive USB device charging systems.
The AP43776Q…
AAEON’s next-generation UP Xtreme i12 utilizes the 12 core, 16 thread hybrid architecture of 12th Generation Intel Core Processors, making it more energy-efficient despite possessing double the previous generation’s thread count. With these improvements, the UP Xtreme i12 offers up to 20% greater CPU performance, while also hosting 32GB onboard…
Open UpCell is a USB Type-C PD single cell lithium-ion battery management system with either 5 v or 3.3 v outputs, up to 14 v input, and an i2c interface for battery and charge status monitoring. You can check battery fuel gauge, charge status, charge voltage selection, charge current selection, and more via the provided Arduino IDE and PlatformIO SDKs. Output…
STMicroelectronics has revealed a wireless power receiver with the industry’s highest available power rating of 100 Watts. This new STWLC99 device can recharge high-end smartphones with the largest battery capacity in less than 30 minutes.
In addition to enhancing user convenience, high-power wireless charging lets…
ROHM Semiconductor today announced they have developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. The new AI chip utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped…
Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements
Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of…
STMicroelectronics has introduced the new flagship 6-axis inertial measurement unit (IMU) LSM6DSV16X that features ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization. It enables sophisticated processing in the edge, making the device ideal for advanced 3D phone…
