To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Open UpCell is a USB Type-C PD single cell lithium-ion battery management system with either 5 v or 3.3 v outputs, up to 14 v input, and an i2c interface for battery and charge status monitoring. You can check battery fuel gauge, charge status, charge voltage selection, charge current selection, and more via the provided Arduino IDE and PlatformIO SDKs. Output…
STMicroelectronics has revealed a wireless power receiver with the industry’s highest available power rating of 100 Watts. This new STWLC99 device can recharge high-end smartphones with the largest battery capacity in less than 30 minutes.
In addition to enhancing user convenience, high-power wireless charging lets…
ROHM Semiconductor today announced they have developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. The new AI chip utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped…
Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements
Texas Instruments announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of…
STMicroelectronics has introduced the new flagship 6-axis inertial measurement unit (IMU) LSM6DSV16X that features ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization. It enables sophisticated processing in the edge, making the device ideal for advanced 3D phone…
Murata, in cooperation with Autotalks, a trailblazer in vehicle-to-everything (V2X) communication solutions, introduced a wireless module solution portfolio through which direct vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication can be supported.
For maximum versatility, this V2X solution can be adapted to…
Open UpCell from Sikra is a USB Type-C PD single-cell lithium-ion battery management system with either 5 v or 3.3 v outputs, up to 14 v input, and an i2c interface for battery and charge status monitoring. Open UpCell is capable of being a simple, rudimentary inverter for a project, with an up to 15 W output (5 v, 3 A) - enough to power a…
onsemi has announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. These devices deliver the electrical efficiency required in high-power applications with RDS(ON) values as low as 1mΩ and target applications…
AAEON has announced the release of the new Compact Fanless Embedded AI System BOXER-8641AI that is powered by the new NVIDIA Jetson AGX Orin and is designed to be exceptionally rugged and durable, with a wide temperature range of -4°F - 131°F (-20°C - 55°C). This new AI system targets applications that previously required dedicated graphic cards to…
Melexis has announced two new automotive current sensors MLX91230 and MLX91231 that offer access to shunt or Hall-type current sensor technologies and can measure voltage, current, and temperature. Designed according to the ISO 26262 functional safety standard, both current sensor devices support ASIL integration and provide customers with…
u-blox has extended its Wi-Fi stand-alone module portfolio with the new NORA-W3 module series that comprises dual-band Wi-Fi 4 (IEEE 802.11a/b/g/n) and Bluetooth LE 5 based upon a Realtek Ameba chipset. This series comes in two variants. The u-blox NORA-W36 with the u-connectXpress software simplifying the integration into the end-product,…
Allegro MicroSystems, Inc. has announced the new A31316 3D Hall-effect position sensor that is offered in an industry-smallest 4 × 4 mm body PCB-less package and is the latest addition to the company’s 3DMAG line of 3D sensors. This new sensor is ideal for automotive safety and advanced driver assistance systems (ADAS) applications…
