New Generation Silicon IGBTs in Small Footprint Enable Reduction in Inverter Power Losses

Published  August 30, 2022   0
L Lakshita
Author
New Generation Silicon IGBTs

Renesas Electronics Corporation has announced the development of a new generation of Si-IGBTs which will be offered in a small footprint while providing low power losses. Aimed at next-generation electric vehicle (EVs) inverters, the new AE5-generation IGBTs significantly improve performance and safety as modules by minimizing parameter variations among the IGBTs and providing stability when operating IGBTs in parallel. Moreover, the silicon-based AE5 process for IGBTs achieves a 10% reduction in power losses compared to the current-generation AE4 products.

These new IGBTs feature Steady performance throughout the operating junction temperature (Tj) range from -40°C to 175°C and stable parallel operation by reducing parameter variations to VGE(off) to ±0.5V. These devices enable a reduction in inverter power losses, improving power efficiency by up to 6% compared to the current AE4 process at the same current density, allowing EVs to drive longer distances and use fewer batteries.

Key Features of AE5 IGBTs

  • Four products targeting 400-800V inverters: 750V withstand voltage (220A and 300A) and 1200V withstand voltage (150A and 200A)
  • Steady performance throughout the operating junction temperature (Tj) range from -40°C to 175°C
  • Industry's highest performance level with an on-voltage Vce (saturation voltage) of 1.3V, a key value for minimizing power loss
  • 10% higher current density compared to conventional products and small chip size (100mm2/300A) optimized for low power losses and high input resistance
  • Stable parallel operation by reducing parameter variations to VGE(off) to ±0.5V
  • Maintains reverse bias safe operating area (RBSOA) with a maximum Ic current pulse of 600A at 175°C junction temperatures, and a highly robust short circuit withstand time of 4µs at 400V.
  • 50% reduction in the temperature dependence of gate resistance (Rg). This minimizes switching losses at high temperatures, spike voltage at low temperatures and short circuit withstand time, supporting high performance designs.
  • Available as a bare die (wafer)
  • Enables a reduction in inverter power losses, improving power efficiency by up to 6% compared to the current AE4 process at the same current density, allowing EVs to drive longer distances and use fewer batteries.

Add New Comment

Login to Comment Sign in with Google Log in with Facebook Sign in with GitHub