New Product

Vishay Intertechnology Releases 1.5 kV Automotive and Commercial IHDV Inductors in Compact Sizes Starting with 20 mm x 14 mm x 14 mm Vishay Intertechnology Releases 1.5 kV Automotive and Commercial IHDV Inductors in Compact Sizes Starting with 20 mm x 14 mm x 14 mm

MALVERN, Pa. — June 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first four devices in its…

ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems

ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which…

Qorvo® Advances X-Band Radar Performance with a More Efficient and  Sensitive Compact Front-End Module Qorvo® Advances X-Band Radar Performance with a More Efficient and Sensitive Compact Front-End Module

GREENSBORO, N.C., June 9, 2026 – Qorvo ®  (Nasdaq: QRVO), a leading global provider of connectivity and power…

Qorvo Launches SOI RF Switches and Digital Step Attenuators for Defense, Aerospace and Infrastructure Applications Qorvo® Simplifies RF Control with SOI Portfolio that Eliminates Negative Bias

GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new…

Infineon Technologies AG introduces new variants of the CoolSET™ System-in-Package, extending the supported output power range Infineon CoolSET™ SiP variants extend output power range to help designers meet EU energy efficiency regulations

Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-…

Qorvo's New RF Switches for Next-Gen 5G Radios Qorvo® Eliminates Cascaded Switches in 5G Radios with New Wideband High-Isolation Family

GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new…

New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation  Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers

CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules,…

Infineon Expands CoolGaN Bidirectional Switches For Wearables Infineon CoolGaN™ BDS 40 V G3 family delivers up to 82 percent footprint reduction for portable power designs

Munich, Germany – 20 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS)…

Platform Root of Trust and secure boot controllers help system architects prepare for emerging mandates across data center and infrastructure platforms Microchip Expands its Family of Post-Quantum‑Ready Root of Trust Controllers for Next‑Generation Systems

CHANDLER, Ariz., April 28, 2026 — As the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology (Nasdaq: MCHP…

ROHM's New Power Supply IC Chipset ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field…