New Product
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Infineon introduces RIC70115 radiation-hardened GaN HEMT driver for satellite and high-reliability space applications Munich, Germany – 15 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the RIC70115, a radiation-hardened (rad hard)… |
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Nuvoton Unveils New Cortex-M23 Microcontroller SOC, NSC128L42, for High-Precision Measurement Applications Hsinchu, Taiwan– June 30, 2026 – Nuvoton Technology Corporation, a leading global semiconductor provider, … |
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Vishay Intertechnology Releases 1.5 kV Automotive and Commercial IHDV Inductors in Compact Sizes Starting with 20 mm x 14 mm x 14 mm MALVERN, Pa. — June 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first four devices in its… |
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ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which… |
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Qorvo® Advances X-Band Radar Performance with a More Efficient and Sensitive Compact Front-End Module GREENSBORO, N.C., June 9, 2026 – Qorvo ® (Nasdaq: QRVO), a leading global provider of connectivity and power… |
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Qorvo® Simplifies RF Control with SOI Portfolio that Eliminates Negative Bias GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new… |
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Infineon CoolSET™ SiP variants extend output power range to help designers meet EU energy efficiency regulations Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-… |
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Qorvo® Eliminates Cascaded Switches in 5G Radios with New Wideband High-Isolation Family GREENSBORO, N.C., May 28, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new… |
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Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules,… |
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Infineon CoolGaN™ BDS 40 V G3 family delivers up to 82 percent footprint reduction for portable power designs Munich, Germany – 20 May 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its CoolGaN™ BDS 40 V G3 bidirectional switch (BDS)… |
