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TDK Announces Expansion of TDK SensEI Edge Intelligence Portfolio with Launch of edgeRX PRO Sensor Module TDK Announces Expansion of TDK SensEI Edge Intelligence Portfolio with Launch of edgeRX PRO Sensor Module

TDK Corporation (TSE:6762) today announced the launch of the TDK SensEI edgeRX PRO, a new high-performance sensor node that expands its predictive maintenance platform, edgeRX.

edgeRX PRO integrates vibration, acoustic, magnetic, temperature, and rotational motion sensing, leveraging an integrated 6-axis IMU and edge AI processing in…

TDK introduces programmable DIN-rail mount isolated DC-DC converters with 120 W and 240 W outputs and wide conversion ratios TDK introduces programmable DIN-rail mount isolated DC-DC converters with 120 W and 240 W outputs and wide conversion ratios

TDK Corporation (TSE:6762) announces the introduction of the TDK-Lambda DDSM 120 W and 240 W programmable DC-DC converters. These products feature a wide input and output voltage range with an isolated design. The DDSM series also offers remote control and real time monitoring via Modbus over USB using the PowerCMC control and monitoring center. In addition, a…

Microchip Advances Space-Grade Timing with Enhanced Radiation Tolerance and Extended Temperature Performance Microchip Advances Space-Grade Timing with Enhanced Radiation Tolerance and Extended Temperature Performance

The Space CSAC-SA65 combines atomic-clock accuracy with built-in 1 PPS disciplining and low-power consumption

CHANDLER, Ariz., Aug. 13, 2026 (GLOBE NEWSWIRE) -- The growing New Space market is fueling demand for smaller, less expensive space hardware to support short-duration missions for applications such as satellite-to-cellular…

New Vishay Intertechnology Y1 Safety Capacitors Require Up to 40 % Less Board Space, Enable Product Miniaturization New Vishay Intertechnology Y1 Safety Capacitors Require Up to 40 % Less Board Space, Enable Product Miniaturization

MALVERN, Pa. — Aug. 11, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AC line rated ceramic disc safety capacitors with a Y1 rating of 300 VAC and 1500 VDC in a surface-mount casing. Designed for EMI / RFI suppression and filtering in industrial environments, the Vishay BCcomponents SMDY1…S series reduces board space requirements by…

ESP32-S31 Dual-Core RISC-V SoC Espressif Starts Mass Production of ESP32-S31 Wireless SoC for Next-Generation AIoT Devices

Espressif Systems has officially started mass production of its new ESP32-S31 wireless microcontroller, making it available to developers and manufacturers worldwide. The latest addition to the ESP32 family is built for demanding AIoT applications, combining faster processing, modern wireless standards, and multimedia support in a single chip. With production now underway, the ESP32-S31 is…

Infineon Unveils Radiation-Hardened GaN Driver For Satellites Infineon introduces RIC70115 radiation-hardened GaN HEMT driver for satellite and high-reliability space applications

Munich, Germany – 15 July 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the RIC70115, a radiation-hardened (rad hard) gallium nitride (GaN) high-electron mobility transistor (HEMT) driver designed for satellite and high-reliability space applications where power conversion performance and long-term operational integrity are critical requirements. The RIC70115 supports…

Nuvoton Introduces NSC128L42 Cortex-M23 MCU Nuvoton Unveils New Cortex-M23 Microcontroller SOC, NSC128L42, for High-Precision Measurement Applications

Hsinchu, Taiwan– June 30, 2026  – Nuvoton Technology Corporation, a leading global semiconductor provider,  has announced the launch of the NSC128L42, a new 32-bit Arm® Cortex®-M23 microcontroller designed for high-precision measurement. This highly integrated solution combines a 24-bit Sigma-Delta ADC, an LCD driver, and high-quality voice synthesis in a…

Vishay Intertechnology Releases 1.5 kV Automotive and Commercial IHDV Inductors in Compact Sizes Starting with 20 mm x 14 mm x 14 mm Vishay Intertechnology Releases 1.5 kV Automotive and Commercial IHDV Inductors in Compact Sizes Starting with 20 mm x 14 mm x 14 mm

MALVERN, Pa. — June 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first four devices in its new IHDV line of high voltage power inductors for next-generation automotive, energy, and industrial systems. Engineered for designs requiring 1.5 kV isolation voltages, and available in compact 0808 (20 mm x 14 mm x 14 mm) and 1008 (25 mm x 20 mm x…

ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems

ROHM has developed the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications.

In the automotive sector, power demand is increasing, particularly in high-end vehicle models. 48V power supply systems are gaining attention as a highly…

Qorvo® Advances X-Band Radar Performance with a More Efficient and  Sensitive Compact Front-End Module Qorvo® Advances X-Band Radar Performance with a More Efficient and Sensitive Compact Front-End Module

GREENSBORO, N.C., June 9, 2026 – Qorvo ®  (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today introduced an X-band radar front- end solution that enables defense system designers to achieve higher performance without increasing size, weight or prime power. Designed for modern phased array and multifunction sensors, the…

Qorvo Launches SOI RF Switches and Digital Step Attenuators for Defense, Aerospace and Infrastructure Applications Qorvo® Simplifies RF Control with SOI Portfolio that Eliminates Negative Bias

GREENSBORO, NC – June 3, 2026 – Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators (DSAs) designed for defense, aerospace and infrastructure customers. This new portfolio simplifies RF system design, reduces BOM complexity and accelerates integration in…

Infineon Technologies AG introduces new variants of the CoolSET™ System-in-Package, extending the supported output power range Infineon CoolSET™ SiP variants extend output power range to help designers meet EU energy efficiency regulations

Munich, Germany – 02 June 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces three new variants of the CoolSET™ System-in-Package (SiP), the ICE188LM, ICE189LM, and ICE180LM, extending the supported output power range and helping white goods manufacturers comply with increasingly stringent EU energy efficiency and standby power regulations. The CoolSET SiP integrates a high-…