Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries.
Tata Electronics has expressed its interest in four states; Odisha, Karnataka, Telangana, and Tamil Nadu as they think they are the perfect locations for setting up the facility
Raja Manickam, who is spearheading the Outsourced Semiconductor Assembly and Test (OSAT) wing of Tata Electronics, has told the media that the company…
Analog Devices, Inc. has announced a three-axis MEMS accelerometer designed for a wide range of healthcare and industrial applications, including vital signs monitoring, hearing aids, and motion-enabled metering devices. The new ADXL367 accelerometer improves power consumption by two times versus a previous generation of the device (ADXL362) while improving…
Analog Devices, Inc. has introduced a new portfolio of next-generation 16-to-24-bit, ultra-high precision successive approximation register (SAR) analog-to-digital converters (ADCs) that simplify the often complex process of designing ADCs into instrumentation, industrial and healthcare applications. This new high-performance SAR ADC family features ADI’s…
The move aspires to lead the country’s long term strategies for perking-up display and semiconductor manufacturing units and also the semiconductor design cluster
The state government of Karnataka has recently signed a deal (MoU) with Israel-based International Semiconductor Consortium (ISMC), which proclaimed to spend $3 billion (Rs…
China is having perfect fab units, which is due to the network effect that appears from having the complete value chain and this is where India needs to work upon and make it stronger
On the second day of the Semicon India convocation in Bengaluru, Siva Sivaram, president of technology & strategy at Western Digital stated…
Nexperia has announced its latest product additions to a growing range of discrete devices which are available in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. Leadless DFN packages are up to 90% smaller than SOT23 packages and this…
As the semiconductor crisis began during the COVID-19 pandemic, many of the Taiwanese firms have shown interest in making more fabs in the US, China, and in Taiwan
Back in the 1980s, Taiwan’s rat-race commenced in the global market for semiconductor manufacturing where TSMC is the leading organization that creates most of the headers…
Prime Minister Modi already held discussions with Intel CEO Pat Gelsinger and a delegation spearheaded by John Neuffer, the CEO of US based Semiconductor Industry Association
In order to boost the growth of semiconductor industry in the country and an effort to set-up top-notch manufacturing clusters, India is now involved in several rounds of discussions with Global Foundries, Intel…
Nisshinbo Micro Devices Inc. has introduced a new reflective type optical sensor NJL5830R that contains a high-power infrared LED, a photodiode sensor, and a signal processing IC in a unique package and has a high resistance to ambient light to prevent operation interference and can even be used for outdoor applications. Typical applications for…
Infineon Technologies AG has introduced a new family of battery management ICs that enables an optimized solution for battery cell monitoring and balancing. Combining excellent measurement performance with the highest application robustness, these new battery management ICs are suitable for a wide range of industrial, consumer, and automotive…
Renesas Electronics Corporation has announced the release of an integrated automotive ECU Virtualization Platform that enables designers to integrate multiple applications into a single ECU that are safely and securely separated from each other to avoid interference. This platform provides a ready-to-use demonstrator environment comprising pre-configured embedded…
Toshiba Electronic Devices & Storage Corporation has extended the TXZ+™ Family Advanced Class with 21 new microcontrollers in the M3H group that have enhanced communications functions integrated as UART, TSPI, I2C, and a 2-unit DMAC. These microcontrollers offer various interface and motor control options and are suited for a wide range of applications…