To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Nexperia has introduced a new range of GaN FET devices that consists of next-gen high-voltage Gan HEMT H2 technology in both TO…
Toshiba Electronic Devices & Storage Corporation has introduced two lens reduction type 1500-pixel monochrome CCD linear image sensors,…
Renesas has expanded its ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the power of embedded artificial…
Infineon Technology has released the second device in the new generation BCR family - BCR431U LED Driver ICs. The new…
Canada based I-SYST has come up with a tiny nRF52840 module that is as small as a fingernail. Named BLYST840, the module has 46…
Renesas introduced four new I3C Basic bus extension products that support up to 12.5MHz speeds with integrated thermal…
Toshiba Electronic Devices & Storage Corporation has added two new interface bridge ICs for automotive In-Vehicle…
OmniVision Technologies has released the CameraCubeChip module named OVM9284. This automotive-grade wafer-level camera is 1…
TE Connectivity has introduced a minimal footprint SMI SO-10 pressure sensor package with a vertical port. It is designed with…
Nexperia has introduced the new range of silicon-germanium (SiGe) rectifiers with 120 V, 150 V, and 200 V reverse voltages that…
STMicroelectronics has introduced the EVL150W-HVSL, a 150W, 1A mains-input driver evaluation board with a reference design that…
The Raspberry Pi Foundation has announced the immediate availability of the Raspberry Pi 8GB version of its new Raspberry…
