To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
A17700 from Allegro is an automotive-grade interface IC that delivers fast, reliable, and flexible output with top-of-the-line signal conditioning algorithms for automotive and industrial pressure sensing applications. This new IC is configurable for resistive bridge pressure sensors in a wide range of critical applications viz. high-pressure systems like dynamic brake…
Texas Instruments has released DRV3255-Q1, a highly integrated Grade 0 brushless DC (BLDC) motor driver for 48-V high-power motor control systems like traction inverters and starter generators in mild hybrid electric vehicles (MHEVs). This new motor driver integrates active short-circuit logic and dynamic fault response. It enables designers to simplify their designs and…
The new silicon carbide (SiC) MOSFETs from On Semiconductor deliver high switching, improved reliability, and improved power density in various industrial and automotive applications. The NVBG015N065SC1, NTBG015N065SC1, NVH4L015N065SC1, and NTH4L015N065SC1 automotive AECQ101 and industrial-grade qualified 650 volt (V) SiC MOSFETs come in D2PAK7L and To247 packages and…
ROHM Semiconductor has recently announced that Embedded Artists is using their highly integrated PMIC, BD71847AMWV along with i.MX 8M Nano from NXP on the new iMX8M Nano uCOM board to deliver a robust and cost-effective solution for industrial applications. This new uCOM board measures 45mm x 42mm and features the i.MX 8M Nano processor with Quad-core ARM Cortex-A53 and…
GeneSiC Semiconductor’s new third-generation 1200V G3R SiC MOSFETs with low on-state resistance and best figure-of-merits can surpass its currently available options in terms of performance, robustness, and quality to harness extremely high levels of efficiency and system reliability in automotive and industrial applications. Faster switching frequency, increased power…
The new high-side current sense amplifiers, MCP6C02 and MCP6C04 from Microchip Technology offer low offset for AEC-Q100 Grade 0 qualified devices, enabling more accurate and energy-efficient current measurement solution for high-temperature automotive applications. These high-voltage current sense amplifiers feature a wide specified input common-mode range, thereby providing…
With 66 % more power compared to traditional silicon chips available in the market, the new NV6128 high power 650V/800V-rated GaNFast power IC from Navitas Semiconductor is suitable for high-power mobile and consumer power electronics. This 70 mOhm device in compact 6 x 8 mm PQFN package is a next-generation semiconductor technology that is capable of running up to 20…
Uniquely combining NFC Type-5 properties with augmented NDEF (NFC Data Exchange Format) and tamper detection, STMicroelectronics’ ST25TV512C and ST25TV02KC tags let developers leverage NFC contactless communication in new and imaginative ways for applications in consumer engagement, brand recognition, supply-chain management, and access control.
…
MLX81114 is the latest member to join Melexis’s line of IC family. This new IC is a variant of the MLX81113 and supports the growth of RGB LED-based automotive ambient lighting (LIN RGB). The device is available in SOIC packaging and its memory access protection feature enables anti-theft applications.
On-chip memory, high output…
LAN9360 from Microchip is the recently released fully integrated AVB audio endpoint solution that helps in reducing development time and eliminates the need for stack integration and additional software and firmware development. This single-chip Ethernet controller with embedded protocols interconnects the infotainment devices of the vehicle such as speakers, amplifiers…
Toshiba Electronics has released a 100 V high-current photorelay, TLP241B for industrial equipment building automation systems and mechanical relay replacements, security systems, heating, ventilation and air conditioning (HVAC), Battery Management System (BMS), etc. Encompassed in a DIP4 package, this new device comprises of a photo MOSFET optically coupled to an infrared…
STMicroelectronics' BPF8089-01SC6 RF front-end for Global Navigation Satellite System (GNSS) receivers simplifies design and saves real-estate by integrating the impedance-matching and electrostatic-discharge (ESD) protection circuitry typically implemented using discrete components.
The BPF8089-01SC6 provides a 50Ω matched interface…
