To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
STMicroelectronics has begun volume production of the STISO621 dual-channel digital isolator, launching a new series of high-performance ICs for industrial applications and general optocoupler replacement.
The STISO621 transfers data between two isolated domains at up to 100Mbit/s, with pulse distortion below 3ns, leveraging ST’s 6kV…
The CL6000 Denali Doppler Radar from Celeno is a single-chip connectivity and sensing solution for IoT end points, home automation, industry automation, multimedia devices, and commercial applications. This new chip family supports Wi-Fi 6/6E standard, audio streaming, and on-boarding use cases with BT and BLE 5.2 support.
The CL6000 Denali Doppler…
Continua MAX38889 from Maxim Integrated is the small-sized backup regulator that delivers high efficiency in industrial, asset tracking, automotive, and healthcare applications. The 2.5V-to-5.5V, 3A reversible buck/boost regulator offers 9% higher efficiency and one-third the size of competing solutions available in the market. This latest addition to Maxim’s Continua…
Sized as small as a €1 coin, the µWAI (micro-WAY) autonomous imager technology from CEA-Leti activates smartphones and small appliances through face recognition or other specific patterns. Ideal for smartphones, smart home appliances, and automobiles, this tiny image sensor features auto-exposure for all lighting conditions and an 88dB dynamic range. The device comes with…
STMicroelectronics has announced a new family of Intelligent and Integrated Gallium Nitride (GaN) solutions, STi2GaN, that is an innovative and unique offering combining power and intelligence in compact, high-performance solutions required by the automotive industry as it shifts to electrified platforms.
Building on ST’s leadership…
Toshiba introduced a new photovoltaic-output photocoupler TLP3910 that consists of an infrared light-emitting diode optically coupled to a photodiode array. This new device is available in a thin SO6L package and suitable for driving high-voltage power MOSFETs with a gate voltage of 10V or higher used as an isolated solid-state relay (SSR).
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Based on the Triaxis Hall magnetic front-end, Melexis’ new MLX90377single- and dual-die (fully redundant) magnetic position sensor IC with new Single Mold Package (SMP) improves PCB-less integration and manufacturing costs in automotive and industrial applications. This new sensor integrates an ADC with signal conditioning, DSP, and an output stage driver that supports SPC (…
Renesas Electronics has made a new addition to its family of 8.2mm creepage photocouplers with the introduction of three new IGBT drivers and IPM driver to reduce PCB mounting area by 35% to maximize board space in industrial automation and solar inverter applications. The RV1S9231A 2.5A output IGBT driver, RV1S9207A 0.6A output IGBT driver, and …
Pre-tested and pre-certified, RYZ014A from Renesas Electronics is an all-in-one, single-mode LTE category M1 module with worldwide deployment and roaming capability. Optimized for wireless IoT networks, this device is one cost-effective solution that simplifies the global development and deployment process by eliminating the need for gateways.
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The new CM5-P1000 COTS PC/104 module from ADLINK is a compact, energy-efficient, and highly effective robust solution that addresses the size, weight, and power (SWaP) restrictions in aerospace and defense applications. This new module comes with NVIDIA Quadro P1000 graphics processing capabilities and is perfect for demanding mission-critical video/imaging analysis…
The STMicroelectronics AIS2IH three-axis linear accelerometer brings enhanced resolution, temperature stability, and mechanical robustness to non-safety automotive applications including anti-theft, telematics, infotainment, tilt/inclination measurement, and vehicle navigation. It also paves the way to new performance-demanding applications in automotive, medical,…
Infineon Technologies along with the Reality AI has created IM67D130A, an advanced sensing solution for vehicles to provide ADAS the sense of hearing for sensing the fast-moving emergency vehicles behind. This new sensing solution combines the XENSIV MEMS microphones with AURIX microcontroller (MCU) and Reality AI’s Automotive See-With-Sound (SWS) system. Developed based on…
