Electronics and Semiconductor News

Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries. 

 

India’s Semiconductor production would craft 35,000 specialized employment and one lakh direct job opportunity in the next couple of years

After an incentive of Rs 76,000 Crore was unleashed by the government to boost the country’s display and semiconductor manufacturing cluster, experts opine that this imperative decision will benefit the…

Melexis has developed the new MLX90510 inductive interface IC that enables high speed resolver minimizing the ECU effort required to get the best accuracy under extreme mechanical and electrical conditions. This IC is designed for demanding high speed sensing applications with EMC and safety requirements and is intended for use in e-motor (e-axle), e-brake…

The union ministry has also passed a new design linked incentive (DLI) plan that will aid scores of domestic firms in designing and developing semiconductors for integrated SoCs and circuits

After several rounds of heated discussions and scuffles, the Indian government has finally approved the incentive package of Rs 76,000 crore ($10 billion) to magnetize the display…

Sensirion has launched the new SGP41 VOC+NOx sensor that is designed as a digital smart switch and regulation unit for indoor air quality applications. This sensor offers a solution for two complete sensors on a single chip, facilitating design-in and cutting design costs, and is suitable for air treatment devices such as air purifiers.

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Infineon Technologies AG has launched the new wireless portfolio AIROC CYW30739 Bluetooth LE & 802.15.4 System on Chip (SoC) that enhances the performance of smart home products with seamless interoperability, while enabling end-to-end encrypted communication between individual devices in a Matter network. This new device offers superior RF performance for robust…

Lumissil Microsystems has announced a new fully integrated switching Buck LED driver IS32LT3961 that features ultra-low 2μA shutdown current, high side current sensing along with spread spectrum for low EMI. This single channel switching LED driver supports digital PWM and/or analog voltage LED dimming techniques which make it suitable for automotive exterior lighting …

MORNSUN has launched the new SCM3425ASA CAN transceiver modules that feature high electromagnetic immunity, low electromagnetic emissions, and meet the AEC-Q100 standard for the automotive industry. This CAN bus transceiver can be widely used in automotive electronics, IoT, industrial electronics, etc.

With an input voltage range of -42VDC to +42VDC…

Quectel Wireless Solutions and Point One Navigation has announced the LG69T-AM GNSS Module which is the latest addition to the LG69T GNSS Module Series and features STMicroelectronics’ TeseoV positioning receiver platform with 80 tracking and 4 fast acquisition channels compatible with GPS, GLONASS, Galileo, BeiDou, QZSS, and NAVIC. This module leverages Point One’…

Sensirion has launched a new product SCD42 in its SCD4x miniaturized CO2 sensor series that offers unmatched cost effectiveness for the US HVAC market and is specifically designed for products that fall under California’s Building Energy Efficiency Standards (Title 24). This new sensor is based on the principle of photoacoustic sensing and combines minimum…

There are complex dependencies on AWS on its internal services and hence one service fails when another fails

Several hours back, a massive dim-out on Amazon’s cloud service network badly deranged important services in several companies in the US that uplifted questions regarding vulnerability of web services and how major tech firms are…

Non-government investors such as Walden, Matrix, and Sequoia joined hands in almost 58 investment deals in China’s chipset making industry from 2017-2020

The worldwide lockdowns, which has escalated the demand of electronic items and digitization, are largely responsible for the global slump in production of chipsets. While the diminutive production of chipsets…

ROHM Group company LAPIS Technology has developed a new chipset that utilizes the 13.56MHz frequency band for both wireless power supply and Near Field Communication (NFC) and contributes to improved design flexibility in devices with rotating mechanisms that would be restricted by wired designs, such as industrial equipment, PC cooling fans, and e-bike torque sensors.…