To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Nexperia has introduced a new range of GaN FET devices that consists of next-gen high-voltage Gan HEMT H2 technology in both TO-247 and CCPAK surface-mount packaging. The GaN technology employs through-epi vias for reducing defects and shrinking the die size up to 24%. The TO-247 package reduces the RDS (on) by 41mΩ (max., 35 mΩ types. at 25 °C) with high threshold…
Toshiba Electronic Devices & Storage Corporation has introduced two lens reduction type 1500-pixel monochrome CCD linear image sensors, TCD1105GFG and TCD1106GFG, for industrial equipment. These new sensors provide faster operation of equipment that incorporates sensors, including inspection equipment with monochrome CCD linear image sensors and they consume lower power.
These…
Renesas has expanded its ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the power of embedded artificial intelligence (e-AI) to provide smart odor sensing for ventilation systems, bathroom monitoring and controls, and air quality monitors. The enhanced platform combines neural network-trained firmware on various microcontrollers (MCUs) like Renesas RL78MCU to…
Infineon Technology has released the second device in the new generation BCR family - BCR431U LED Driver ICs. The new constant current linear LED driver IC provides low voltage drop performance for regulating LED current and it focuses on low current designs of up to 37mA. The IC can have an unmatched voltage drop of 105mV at 15mA in the industry that can provide far…
Canada based I-SYST has come up with a tiny nRF52840 module that is as small as a fingernail. Named BLYST840, the module has 46 I/O, 1 MB flash, 256 kB RAM, is ready for Bluetooth 5.2, is Thread, and ZigBee capable, NFC-enabled, comes with built-in security measures and supports MicroPython. The nRF52840 ARM Cortex-M4F module is feature-rich with ultra-low-power SoM that…
Renesas introduced four new I3C Basic bus extension products that support up to 12.5MHz speeds with integrated thermal sensor capability. The new product series include the IMX3102 2:1 bus multiplexer, suited for designs where there may be two masters controlling a single peripheral or slave devices, the IMX3112 1:2 bus expander that supports designs where a single host…
Toshiba Electronic Devices & Storage Corporation has added two new interface bridge ICs for automotive In-Vehicle Infotainment (IVI) systems, namely “TC9594XBG (Parallel to MIPI DSI)” and “TC9595XBG (MIPI DSI /DPISM to DisplayPort)” as a lineup to its display interface bridge ICs.
Features of TC9594 and TC9595 Display Driver IC…
OmniVision Technologies has released the CameraCubeChip module named OVM9284. This automotive-grade wafer-level camera is 1 megapixel (MP) module that measures 6.5 x 6.5 mm and provides driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. It is built on OmniVision’s OmniPixel 3-GS global-shutter…
TE Connectivity has introduced a minimal footprint SMI SO-10 pressure sensor package with a vertical port. It is designed with a MEMS pressure sensor and an advanced signal-conditioning IC which is combined to provide fully pressure calibrated and temperature compensated output. The device covers gauge pressure ranges from .5 to 30PSI with a digital (I2C) or dual output (…
Nexperia has introduced the new range of silicon-germanium (SiGe) rectifiers with 120 V, 150 V, and 200 V reverse voltages that deliver high efficiency of their Schottky counterparts along with thermal stability of fast recovery diodes. The new devices are designed to be operated in the automotive, communication infrastructure, and server markets.
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STMicroelectronics has introduced the EVL150W-HVSL, a 150W, 1A mains-input driver evaluation board with a reference design that integrates features that ensure high performance. The new evaluation board achieves a full load efficiency above 91% to maximize utility-cost saving for street lamp operators. The board is designed to analog, resistive, and PWM (Pulse Width…
The Raspberry Pi Foundation has announced the immediate availability of the Raspberry Pi 8GB version of its new Raspberry Pi 4 Boards. Almost a year back when the Raspberry Pi 4 was introduced, the official website mentioned an 8GB version initially, but later removed it citing it as a typo for 4GB. But as Eben Upton, CEO of Raspberry Pi Foundation says it became the “…
