To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Renesas Electronics Corporation introduced a highly integrated Power Management IC (PMIC), ISL78083 that simplifies power…
Infineon Technologies has collaborated with software and 3D Time of Flight system specialists, pmdtechnologies to develop the…
Designers of ultra-low-power portables and wearables can shrink the size of a power and communication interface to the charging…
Maxim Integrated has introduced MAX16923 4-output display power IC with watchdog timer, aimed for automotive display…
Nuvoton Technology Corporation has introduced a new NuMicro M2351SF chip, the first Arm Cortex M23 based MCU which is based on…
RCOM has introduced the RHV2 and RHV3 series of ultra-high isolation DC/DC converters with the output of 2W or 3W. The…
MORNSUN has introduced the latest SCM13xxA series DC/DC Buck IC namely SCM1301ATA and SCM1316AFA. They are equipped with the…
The Toshiba Electronic Devices & Storage Corporation has introduced GT20N135SRA, a 1350V discrete IGBT for tabletop IH…
Toshiba Electronic Devices and Storage Corporation has introduced two new 100V N-channel power MOSFET namely XPH4R10ANB and…
Nordic Semiconductors has introduced the nRF21540TM RF Front End Module (FEM), a power amplifier/low noise amplifier (PA/LNA)…
Infineon Technologies has introduced the new IGBT 7 (FF900R12ME7_B11) module for industrial drive applications and other…
Diodes Incorporated has introduced the AL8843Q and AL8862Q, automotive-compliant DC-DC buck converters for driving single LEDs…
