To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Texas Instruments has expanded its portfolio of temperature sensors with the new TMP61, TMP63, and TMP64 Linear Thermistors.…
Broadcom Inc has introduced a new Wi-Fi 6E client device called BCM4389, the new device extends Wi-Fi 6 standard and supports…
Semtech Corporation has announced the four-line, 5V RClamp0504FB TVS Diode as the latest addition to their Rclamp platform,…
Microchip has introduced the next generation PIC18-Q43 family of PIC Microcontrollers that helps developers in offloading many…
AAEON has announced the PICO-WHU4, a compact board built on the PICO-ITX form factor and powered by 8th generation Intel core…
Japan Display in collaboration with researchers from the University of Tokyo has developed a new type of Biometric Sensor …
ROHM has introduced a new Automotive Grade Intelligent Power Device (IPD) named BV2Hx045EFU-C. This new family of 41V dual…
ON Semiconductors has introduced a new family of four devices that can provide better performance and innovative…
United SiC has introduced a new series of SiC FETs, under the new UF3C/UF3SC series. These new series provide higher switching…
Infineon Technologies has introduced a new flyback controller IC to its XDP series of Digital Power controllers. This new…
ROHM has introduced BD71850MWV, a highly integrated and efficient power management IC (PMIC) optimized for NXP Semiconductors’…
The Renesas Electronics Corporation has announced the ISL70005SEH, a synchronous buck and low dropout (LDO) regulators for low-…
