To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Texas Instruments introduced two new isolated CAN flexible data rate (FD) transceivers that combine high bus fault protection, high common-mode transient immunity (CMTI), and low electromagnetic emissions into a 35 percent smaller package. The ISO1042 and ISO1042-Q1 transceivers provide a higher working voltage than competing devices and faster communication speeds than the…
Toshiba announced the launch of TCB702FNG, an addition to its 4-channel high-efficiency linear power amplifiers that meet current market requirements for high efficiency. With the new power amplifier, Toshiba has improved on its technology to realize efficiency comparable with a digital high efficiency of class D amplifier in actual operating range (0.5 to 4W). Power…
Maxim’s new isolated RS-485 module transceiver with power - MAXM22511 simplifies and shrinks the design of field bus communications systems for factory automation, motor control and other industrial internet of things (IoT) applications.
In order to actively monitor and communicate real-time health and status…
STMicroelectronics released two new microcontrollers STM32L412 and STM32L422 with a focused feature set and compact size, to provide ultra-low power technologies and high performance to budget-conscious consumer, industrial, and medical applications.
Combining economical 64Kbyte or 128Kbyte Flash density…
Texas Instruments released the industry's first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara™ AM6x processor family offers industrial-grade reliability, with quad and dual Arm® Cortex®-A53 core variants to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid…
Texas Instruments announced a new portfolio of ready-to-use, 600-V gallium nitride (GaN), 50-mΩ and 70-mΩ power stages to support applications up to 10 kW. The LMG341x family enables designers to create smaller, more efficient and higher-performing designs compared to silicon field-effect transistors (FETs) in AC/DC power supplies, robotics, renewable energy, grid…
The LSM6DSO iNEMO™ Inertial Measurement Unit (IMU) from STMicroelectronics is an always-on 3D accelerometer and 3D gyroscope system-in-package that is power efficient and accurate. At the same time, the IMU makes the entire embedded system around it more power efficient, too.
Two key features play into this…
Texas Instruments introduced a new temperature sensor family that offers ±0.1°C accuracy across a wide temperature range and helps simplify system design for industrial and medical applications. The TMP117 is the first single-chip temperature sensor to offer similar performance to platinum resistance temperature detectors (RTDs) while significantly reducing design complexity…
Now engineers designing into applications in factory automation, medical, communications and consumer markets can tap into four new micro-system-level IC (“uSLIC™”) modules from Maxim Integrated. The MAXM17552, MAXM15064, MAXM17900 and MAXM17903 step-down DC-DC power modules join Maxim’s extensive portfolio of Himalaya power solutions, providing the widest input voltage…
Sensirion announced its new humidity and temperature sensor module, the SCC30-DB, that can be placed anywhere in a device and connected by the main board with a cable. Some applications require a humidity and temperature sensor to be located in a specific part of the device – often at a different location to the main control board, making the SCC30 a good choice for such…
Minimizing power consumption in portable electronics devices is a top priority for product designers. In order to meet the expectations and help increase the battery-life, Microchip introduced a linear Low Dropout (LDO) regulator that extends battery life in portable devices up to four times longer than traditional ultra-low quiescent (Iq) LDOs. With an ultra-low Iq of 250…
Silicon Labs released new LTE-M expansion kit featuring Digi XBee3™ pre-certified cellular modem to provide ultra-low-power, long-range wireless connectivity to battery-powered IoT devices. The LTE-M expansion kit works with Silicon Labs' EFM32 Giant Gecko 11 starter kit and simplifies and accelerates the development of gateways and end devices that operate in…
