To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
STMicroelectronics has introduced a new STPD01 DC/DC buck converter that is digitally programmable for USB Power Delivery (PD) applications up to 60W and features a synchronous topology for optimum efficiency. This new device with a wide input-voltage range of 6V to 26.4V, offers flexibility to address applications such as AC multiport adapters, USB hubs, PC monitors,…
Toshiba Electronic Devices & Storage Corporation has launched two photorelays “TLP223GA” and “TLP223J,” with an OFF-state output terminal voltage rating of 400V and 600V that feature low input power, improved switching characteristics, and are housed in a DIP4 package. These new products come with high luminous efficiency LED and have a maximum trigger LED current…
Allegro MicroSystems, Inc. has introduced the new A19360 wheel speed and distance sensor that uses giant magnetoresistance (GMR) technology to encode the speed and direction of rotating ring magnets, providing automakers with the signal resolution and reliability required for SAE Level 4 and SAE Level 5 automation in passenger vehicles and mobility-as-a-…
Toshiba Electronic Devices & Storage Corporation has introduced new “TCK12xBG Series” of load switch ICs that uses a new driver circuit, which realizes a typical ON-state quiescent current of 0.08nA. Housed in a small WCSP4G package, these new ICs are suitable for the new generation of wearables and IoT devices that consume less power and offer a longer charge life…
Toshiba Electronic Devices & Storage Corporation has added “TC9563XBG” to its line-up of Ethernet bridge ICs to provide support for 10Gbps communications in automotive information communications systems and industrial equipment. This new IC is AEC-Q100 Grade 3 qualified and can be used in applications such as IVI and telematics.
This new…
Sensata Technologies has introduced the new GXC and MXC series of Smart-Tactor contactors with CAN bus communication that provides valuable data for improved system performance, reliability, and diagnostics in the military, battery system, energy storage, commercial vehicle, and industrial applications. This new series of contactors are easily integrated and simply data…
Toshiba Corporation has expanded its SCiB product offering with the launch of an innovative 20Ah-HP rechargeable lithium-ion battery cell that delivers high energy and high power at the same time and is ideal for heavy-load applications. This new 20Ah-HP cell is suitable for situations where battery cells must suppress heat and operate continuously, such as rapid…
German venture studio Next Big Thing AG (NBT) has launched an IoT sensor-based development platform ‘Prometheus’ which is powered by Nordic’s nRF9160 low power System-in-Package (SiP) with integrated LTE-M/NB-IoT modem and GNSS and is designed to simplify prototyping and speed time-to-market for developers of cellular IoT- and Cloud-based solutions. This platform…
Analog Devices, Inc. has introduced two nanoPower modules with built-in inductors that feature the lowest IQ compared to competitive solutions and deliver more battery life in space-constrained internet of things (IoT) devices. The new MAXM38643 buck and MAXM17225 boost modules are designed for space-constrained consumer products, wearables, medical drug delivery, sensors,…
MORNSUN has launched the new miniaturized LO30-20BxxMU Series that is designed to meet the demand for medical power supply and is the extension of 30W products after 45W/65W/120W series. This series meets the reinforced insulation 2xMOPP and has the advantages of small size, low power consumption, and high efficiency.
The LO30-20BxxMU Series is…
NXP Semiconductors has updated its industry leading automotive radar portfolio with two new imaging radar processors NXP S32R45 and NXP S32R41 that together serve the L2+ through L5 autonomy sectors, enabling 4D imaging radar for 360-degree surround sensing. The combination of NXP’s S32R45 and S32R41 radar processors with the NXP TEF82xx RFCMOS transceivers delivers the…
RejsaCAN-ESP32 is a small board based on ESP32-WROOM-32 Wi-Fi and Bluetooth module with a CAN interface that fits into a 3D printed OBD-II dongle for easy installation into most cars and includes an auto-shutdown option to prevent battery drain by monitoring the battery voltage in the car.
RejsaCAN-ESP32 PCB has been designed in EasyEDA …
