Nexperia
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Nexperia Unveils 12-Channel 40V LED Driver for Safer and More Efficient Automotive Lighting Nexperia has introduced a new 12-channel, 40V LED driver IC, especially made for automotive lighting. Such as tail lights, brake lights, signal lights, and in-cabin illumination, it is AEC-Q100 qualified and ASIL-B compliant. One of the biggest advantages of the NEX13120FPC-Q100 is its exceptional thermal performance. It has a… |
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Nexperia's New DC-DC Converters Deliver High Efficiency and Flexibility for Wearables, IIoT, and Automotive Systems Nexperia introduced a new line of step-down DC-DC converters for battery-operated devices that are more flexible and efficient. These converters work with both portable and fixed battery-powered devices. The NEX30606 offers 16 different output voltages ranging from 1.8 V to 5.0 V, enabling its high efficiency and accuracy. These are… |
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Nexperia’s High-Density CCPAK1212 MOSFETs: With Top-Side and Bottom-Side Cooling Options for Power-Intensive Applications Nexperia has launched 16 new power MOSFETs in the copper-clip CCPAK1212 package, which includes both 80 V and 100 V variants. These components feature an innovative copper-clip design that enhances current conduction, reduces parasitic inductance, and provides excellent thermal performance. They are suitable for a range of applications, including motor control, power… |
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Nexperia Releases New 80 V and 100 V LFPAK MOSFETs with Lower On-Resistance Nexperia has expanded its NextPower 80 V and 100 V MOSFET lineup by introducing new LFPAK devices in 5x6 mm and 8x8 mm sizes. These MOSFETs are optimized for high efficiency and low electrical noise, making them ideal for use in servers, power supplies, fast chargers, USB-PD, telecommunications, motor control, and other industrial equipment. They come in different… |
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Nexperia Expands SiC MOSFET Portfolio with D2PAK-7 Packaging Nexperia has introduced its latest innovation in power electronics, announcing the availability of 1200 V silicon carbide (SiC) MOSFETs in D2PAK-7 surface mount device (SMD) packaging. With RDS (on) values ranging from 30 to 80 mΩ, this release marks a significant expansion of Nexperia's SiC MOSFET portfolio. Following the introduction of SiC MOSFETs in TO-247… |
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New Planar Schottky Diodes in Space-Saving CFP3-HP Packaging Optimized for Automotive Applications Nexperia has announced a new portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. This portfolio includes 11 industrial, and 11 AEC-Q101 qualified products. This release supports the growing trend for manufacturers to replace devices in SMx-type packaging with smaller footprint CFP-packaged devices, especially in automotive… |
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New LCD Bias Power ICs Extend Battery Life and Video Display Lifetime in Smartphones and VR Headsets Nexperia has introduced a new series of space-saving, high-efficiency, dual-output LCD bias power supplies that are designed to extend the lifetime of thin film transistor liquid crystal display (TFT-LCD) panels used in various applications including smartphones, tablets, virtual reality (VR) headsets, and LCD modules. The new NEX10000 is an 80 mA dual… |
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New Wafer-Level 12V & 30V MOSFETs Save Power and Simplify Thermal Management in Space-Constrained Applications Nexperia has introduced the new PMCB60XN and PMCB60XNE 30V N-channel small-signal trench MOSFETs, with market-leading RDS(on) in the ultra-compact wafer-level DSN1006 package to make energy go further where space is tight and battery runtime is critical. Ideal for highly miniaturized electronics like smartphones, smart watches, hearing aids, and earphones,… |
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New Rugged and Reliable Devices in Miniature DFN Packaging with Side-Wettable Flanks Nexperia has announced its latest product additions to a growing range of discrete devices which are available in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. Leadless DFN packages are up to 90% smaller than SOT23 packages and this… |
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Advanced Electrothermal MOSFET Models enable Investigation of EMC Performance even Before Prototyping Nexperia has announced the release of enhanced Electrothermal models that capture the thermal interdependency of the complete set of device parameters right across the full operating temperature range from -55 °C to 175 °C. These new devices enable engineers to create an accurate circuit and system-level simulations and assess the electrical, thermal, and EMC performance… |
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AEC-Q101 Qualified ESD Protection Solutions for Automotive Ethernet Nexperia has announced an expansion to its portfolio of automotive ethernet ESD protection devices with three new devices that are AEC-Q101 qualified and are designed to protect two bus lines from damage caused by ESD and other transients. The new PESD2ETH1GXT-Q, PESD1ETH1GLS-Q, and PESD1ETH1GXLS-Q devices are silicon-based and provide an improved diode… |
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SD Card Level Translator with Integrated Auto-Direction Control and EMI Filter Nexperia has introduced a small Secure Digital (SD) card level translator IC “NXS0506UP” that is housed in a 16-bump wafer-level chip-scale package and has a footprint measuring 1.45mm x 1.45mm x 0.45mm. This SD 3.0-compliant bi-directional dual voltage level translator features integrated auto-direction control, EMI filter and is designed to operate at clock… |
