Nexperia has announced a new portfolio of 22 new planar Schottky diodes in CFP3-HP packaging. This portfolio includes 11 industrial, and 11 AEC-Q101 qualified products. This release supports the growing trend for manufacturers to replace devices in SMx-type packaging with smaller footprint CFP-packaged devices, especially in automotive applications. These diodes are suitable for use in DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications. For maximum design flexibility, device options in this portfolio are offered with reverse voltages VR(max) ranging from 30 V to 100 V and forward currents IF(average) between 1 A and 3 A.
The exposed heatsink, which is a feature of the CFP3-HP enables it to provide the highest level of heat dissipation (Ptot) for such a small package footprint (3.7 mm x 1.8 mm x 0.9 mm). Utilizing the proprietary copper clip design, these packages meet the challenging demands of efficient and space-saving designs.
Key Features
- Solid copper clip for high thermal performance and power dissipation
- Reduced package inductance for improved switching behavior
- High reliability (2 x AEC-Q101, Board Level Reliability compliance)
- Free from delamination
- Junction temperature up to 175 °C
- Small, thin and light design
- Optimized lead form ensuring uniform solder joints for maximum flexibility in AOI
- Secure supply in high volumes
