data centers

ROHM RY7P250BM MOSFET for Efficient Power ROHM’s New 100V MOSFET Offers 18% Lower ON-Resistance for Power Systems in AI Servers

ROHM has introduced a new 100V power MOSFET called RY7P250BM that’s optimized for hot-swap circuits in 48V power systems that we see in AI servers…

Hybrid GaN-CMOS Chip Enables Faster, Efficient Electronics MIT Combines GaN and Silicon Chips for Faster, Efficient Electronics

Researchers from MIT and elsewhere have developed a new way to combine two types of chips: gallium nitride (GaN) and silicon-based CMOS chips into…

Cadence and Samsung Partner for Advanced Chip Design Cadence and Samsung Foundry Sign Multi-Year Deal for Advanced Chip Design

Cadence and Samsung Foundry have entered a new multi-year agreement, continuing their current collaboration. The partnership is directed towards…

Cyient and MIPS Partner for Custom Semiconductors Cyient and MIPS Collaborate on Domain-Optimized Semiconductor Platforms

Cyient Semiconductors and MIPS have announced a strategic collaboration to develop ASIC and ASSP solutions using MIPS Atlas processor IP. They aim…

Broadcom Ships Tomahawk 6, Industry-Leading Switch Tomahawk 6 by Broadcom, The First 102.4 Tbps Ethernet Switch Chip Powering AI Networks

Broadcom Inc. has introduced Tomahawk 6, the world’s first 102.4 Terabits per second Ethernet switch chip, and it’s already started shipping. This…

L&T Semiconductor Advances India’s Chip Design Industry L&T Semiconductor Advances Chip Design with Focus on Automotive, Industrial, and Energy Markets

L&T Semiconductor Technologies, a fabless chip design company, is making strides towards bolstering the country’s semiconductor industry. Its…

Molex VersaBeam EBO Connectors Molex VersaBeam EBO Connectors Enable Low-Maintenance Fiber Solutions for Data Centers

Molex has launched its new VersaBeam Expanded Beam Optical (EBO) Interconnect Solutions, designed to make high-speed…

Infineon's New TDM2454xx Quad-Phase Power Modules Infineon Introduces TDM2454xx Power Modules for High-Performance AI Data Centers

Infineon Technologies, has launched its latest high-density power modules designed to support AI and high-performance…

Microchip Launches PCI100x PCIe Switches for Data Centers and HPC Microchip Launches PCI100x PCIe Switches with High-Speed Data Transfer for Data Centers and HPC

Microchip Technology introduces a new PCI100x family of Switchtec PCIe Gen 4.0 switches, to meet the needs of high-…

Satya Nadella, CEO of Microsoft Microsoft to Invest $3 Billion in AI and Cloud Infrastructure in India

Microsoft CEO Satya Nadella has announced that the company will invest $3 billion in India to enhance its AI and cloud infrastructure. This…