The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). The combined investments amount to ₹4,600 crore. Proposals came from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
These facilities are expected to employ 2,034 skilled professionals and also generate indirect jobs in the process. This brings the total ISM-approved projects to ten, with cumulative investments of around ₹1.60 lakh crore across six states. In Odisha’s Info Valley, Bhubaneswar, SiCSem, teaming up with UK-based Clas-SiC Wafer Fab Ltd., will establish India’s first-ever commercial Silicon Carbide (SiC) compound semiconductor fabrication plant. It will have the capacity to make 60,000 wafers and package 96 million units annually for use in sectors such as defence, electric vehicles, railways, fast chargers, data centres, appliances, and solar inverters.
Also in Odisha, 3D Glass Solutions will set up an advanced packaging and embedded glass substrate unit. The unit expects to hit an annual target of 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules for applications in defence, AI, automotive, photonics, and high-performance computing. ASIP Technologies will build a semiconductor facility in Andhra Pradesh, in collaboration with APACT Co. Ltd, South Korea, with an annual output of 96 million units. CDIL will expand its Mohali, Punjab, plant to produce high-power discrete components like MOSFETs, IGBTs, diodes, and transistors, with a capacity of 158.38 million units a year.
