data centers
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Messe Muenchen India and dmg events Announce Partnership to Launch AiX DataWorld 2027 Mumbai: As India’s data centre market expands rapidly alongside growing demand for artificial intelligence, cloud computing and digital services, Messe Muenchen India, in partnership with dmg events, will launch AiX DataWorld 2027, a dedicated conference and platform with two editions in Mumbai and Chennai for the country’s data centre industry. The partnership announcement reflects a defining… |
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Amphenol's Interconnect Solutions: A Technical Overview of ExaMAX, HD Express, AirMax VS, and XCede Modern server and data center design places increasing demands on the physical interconnect layer. At 112 Gbps and beyond, connectors are no longer treated as simple passive components; their design has a direct impact on crosstalk, impedance continuity, and mechanical integrity across the system. The following provides a technical overview of four Amphenol interconnect product families… |
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TE Connectivity’s 56G MezzaWave Connectors and Cable Assemblies Feature Open-Pin-Field Architecture Bandwidth requirements in data centers, edge computing, and industrial automation are rising faster than the board space available to support them, and the equipment running these workloads often has to keep performing in conditions that are anything but gentle. That combination puts unusual strain on interconnects, which is precisely the segment TE Connectivity is targeting with its 56G… |
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Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high‑voltage power applications. The new modules integrate 3.3 kV silicon carbide (SiC) mSiC® MOSFETs and Schottky diodes in an… |
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Infineon expands AI data center voltage regulation (VR) portfolio with new multiphase buck controllers and PMBus PoLs Munich, Germany –17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its voltage regulation (VR) solutions portfolio for DC-DC conversions in AI data centers with two new product families spanning digital control and telemetry-enabled point-of-load regulation. Together, the new XDPE1E digital multiphase PWM buck controllers and TDA49720/12/06 PMBus PoLs help… |
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Cyient Semiconductors Announces Agreement to Acquire Controlling Stake in Kinetic Technologies Cyient Semiconductors has entered into an agreement to acquire a controlling stake in Kinetic Technologies. Expected to close in the months ahead, the acquisition can involve a transaction of up to $93 million. The existing leadership and engineering team within Kinetic Technologies will continue operating within their current structure, while synchronizing with Cyient Semiconductors' strategy… |
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India Approves Four New Semiconductor Projects Worth ₹4,600 Crore Across Three States The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). The combined investments amount to ₹4,600 crore. Proposals came from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies. These facilities are expected to employ 2,034 skilled… |
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ROHM’s New 100V MOSFET Offers 18% Lower ON-Resistance for Power Systems in AI Servers ROHM has introduced a new 100V power MOSFET called RY7P250BM that’s optimized for hot-swap circuits in 48V power systems that we see in AI servers and industrial power supplies. The product is tailored for AI servers and data centers, where rising power demands from generative AI and high-performance GPUs push systems to adopt more efficient 48V architecture. Hot-swap circuits are circuits… |
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MIT Combines GaN and Silicon Chips for Faster, Efficient Electronics Researchers from MIT and elsewhere have developed a new way to combine two types of chips: gallium nitride (GaN) and silicon-based CMOS chips into a single chip. The solution is cheaper, scalable, and more energy-efficient. Gallium nitride chips are not cheap or easy to work with, but they are faster and better at handling power. Silicon chips, on the other hand, are cheap and common but lack… |
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Cadence and Samsung Foundry Sign Multi-Year Deal for Advanced Chip Design Cadence and Samsung Foundry have entered a new multi-year agreement, continuing their current collaboration. The partnership is directed towards developing AI-driven chip design solutions for AI data centers, automotive technologies, and next-gen wireless/RF connectivity. Cadence is to provide memory and interface IP for Samsung’s advanced chip manufacturing processes: SF4X, SF5A, and SF2P.… |
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Cyient and MIPS Collaborate on Domain-Optimized Semiconductor Platforms Cyient Semiconductors and MIPS have announced a strategic collaboration to develop ASIC and ASSP solutions using MIPS Atlas processor IP. They aim to deliver domain-optimized solutions for automotive, industrial, and data center applications. The companies believe that their collaboration will allow for the development of next-gen semiconductor solutions that use embedded intelligence, real-… |
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Tomahawk 6 by Broadcom, The First 102.4 Tbps Ethernet Switch Chip Powering AI Networks Broadcom Inc. has introduced Tomahawk 6, the world’s first 102.4 Terabits per second Ethernet switch chip, and it’s already started shipping. This new chip is designed for large-scale AI training and inference clusters, providing the highest bandwidth and performance that can be packed in a piece of silicon. The Tomahawk 6 is twice what its predecessors were in terms of switching… |
