data centers
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Amphenol's Interconnect Solutions: A Technical Overview of ExaMAX, HD Express, AirMax VS, and XCede Modern server and data center design places increasing demands on the physical interconnect layer. At 112 Gbps and beyond, connectors are no… |
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TE Connectivity’s 56G MezzaWave Connectors and Cable Assemblies Feature Open-Pin-Field Architecture Bandwidth requirements in data centers, edge computing, and industrial automation are rising faster than the board space available to support them… |
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Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers CHANDLER, Ariz., May 26, 2026 —Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules,… |
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Infineon expands AI data center voltage regulation (VR) portfolio with new multiphase buck controllers and PMBus PoLs Munich, Germany –17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its voltage regulation (VR) solutions portfolio… |
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Cyient Semiconductors Announces Agreement to Acquire Controlling Stake in Kinetic Technologies Cyient Semiconductors has entered into an agreement to acquire a controlling stake in Kinetic Technologies. Expected to close in the months ahead… |
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India Approves Four New Semiconductor Projects Worth ₹4,600 Crore Across Three States The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM). The combined investments… |
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ROHM’s New 100V MOSFET Offers 18% Lower ON-Resistance for Power Systems in AI Servers ROHM has introduced a new 100V power MOSFET called RY7P250BM that’s optimized for hot-swap circuits in 48V power systems that we see in AI servers… |
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MIT Combines GaN and Silicon Chips for Faster, Efficient Electronics Researchers from MIT and elsewhere have developed a new way to combine two types of chips: gallium nitride (GaN) and silicon-based CMOS chips into… |
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Cadence and Samsung Foundry Sign Multi-Year Deal for Advanced Chip Design Cadence and Samsung Foundry have entered a new multi-year agreement, continuing their current collaboration. The partnership is directed towards… |
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Cyient and MIPS Collaborate on Domain-Optimized Semiconductor Platforms Cyient Semiconductors and MIPS have announced a strategic collaboration to develop ASIC and ASSP solutions using MIPS Atlas processor IP. They aim… |
