Automotive
|
Vishay’s New IHDM Inductors Deliver 30% Higher Current Performance for Automotive Applications Vishay Intertechnology has introduced two new automotive-grade inductors. Both IHDM-1107BBEV-2A and IHDM-1107BBEV-3A come in a 1107 case size with soft saturation current up to 422 A, depending on the model. These are through-hole, edge-wound inductors with a powdered iron alloy core that works reliably from -40 to +180 °C, keeping power losses to a minimum and achieving high thermal… |
|
Vishay Launches 1500 W TVS Diodes in Compact SMB Package for Automotive Applications Vishay Intertechnology has released a new series of surface-mount transient voltage suppressors (TVS) that are rated at 1500 W. Designed for reliable performance in automotive systems, the T15BxxA (unidirectional) and T15BxxCA (bidirectional) series are qualified to AEC-Q101 standards and can operate at temperatures up to +185 °C. These devices, packaged in the compact SMB (DO-214AA)… |
|
Tata Electronics and Bosch Sign MoU for Collaboration in Chip Manufacturing and Automotive Electronics To collaborate on key areas in semiconductor manufacturing and automotive electronics, Tata Electronics and Robert Bosch GmbH have signed a Memorandum of Understanding (MoU). Under this strategic partnership between the two big players in the electronics sector, the companies plan to undertake joint efforts in chip packaging and manufacturing at Tata Electronics’ upcoming facilities in Assam… |
|
Vishay Introduces 0402 Case Size in CHA Series Resistors, AEC-Q200 Qualified Vishay Intertechnology has announced an expansion of its CHA series of thin film chip resistors. The resistors, being AEC-Q200 qualified, meet strict automotive reliability standards. The initial launch was in a 02016 case size, supporting up to 70 GHz, and the currently introduced model is in a 0402 case size. Though the frequency performance goes slightly down from up to 70GHz to… |
|
Cadence and Samsung Foundry Sign Multi-Year Deal for Advanced Chip Design Cadence and Samsung Foundry have entered a new multi-year agreement, continuing their current collaboration. The partnership is directed towards developing AI-driven chip design solutions for AI data centers, automotive technologies, and next-gen wireless/RF connectivity. Cadence is to provide memory and interface IP for Samsung’s advanced chip manufacturing processes: SF4X, SF5A, and SF2P.… |
|
Cyient and MIPS Collaborate on Domain-Optimized Semiconductor Platforms Cyient Semiconductors and MIPS have announced a strategic collaboration to develop ASIC and ASSP solutions using MIPS Atlas processor IP. They aim to deliver domain-optimized solutions for automotive, industrial, and data center applications. The companies believe that their collaboration will allow for the development of next-gen semiconductor solutions that use embedded intelligence, real-… |
|
Rare Earth Magnet Shortage Threatens Auto Production in India As reported in recent CNBC coverage, India’s automotive sector is bracing for potential production delays as a global shortage of rare earth magnets, critical for both electric vehicles (EVs) and traditional internal combustion engine (ICE) vehicles, has begun to put a strain on supply chains. China has control over 90% of the global supply of rare earth materials. The country’s priorities are… |
|
L&T Semiconductor Advances Chip Design with Focus on Automotive, Industrial, and Energy Markets L&T Semiconductor Technologies, a fabless chip design company, is making strides towards bolstering the country’s semiconductor industry. Its portfolio of products targeting the automotive, industrial, and energy sectors keeps expanding. At present, they entertain over 50 customers and are running 11 active projects. The company believes it has paced ahead of its planned timeline for the… |
|
India to Launch First Locally Made Semiconductor Chip in 2025 India is ready to roll out its first homegrown semiconductor chip in 2025, Union Minister for Electronics and IT, Ashwini Vaishnaw, confirmed during the Confederation of Indian Industry’s (CII) Annual Business Summit. The development was made under a dedicated initiative launched in 2022. The chip will fall within the 28 to 90 nanometre (nm) range. The minister stated, “Today, six… |
|
TSMC Brings Advanced Chip Design to Munich as Europe Chases AI Edge Plans to establish a chip design centre in Munich, Germany, were announced by TSMC, the world’s largest contract semiconductor foundry. The new facility is intended to support European clients in developing high-performance, high-density, and energy-efficient integrated circuits. According to Paul de Bot, President of TSMC Europe, the Munich Design Centre intends to focus on design… |
|
Nuvoton Launches 4th Generation Gerda HMI Display ICs for Automotive Safety and UX Nuvoton Technology Corporation Japan (NTCJ) has started mass production of its 4th-generation Gerda HMI display ICs, available in three variants. These ICs are designed to support future vehicle display systems, including electronic mirrors, AR head-up displays, and digital clusters, striving to improve driver visibility, comfort, and security. Gerda-4M addresses optical challenges in… |
|
Synaptics and Murata Collaborate to Launch Next-Gen Automotive Wi-Fi and Bluetooth Connectivity Module Synaptics Incorporated and Murata Manufacturing have announced a partnership to jointly develop a turnkey wireless connectivity module designed for automotive Tier 1 suppliers and OEMs. This module will integrate Synaptics’ Veros Wi-Fi and Bluetooth combo systems on chips (SoCs) with Murata’s compact module design expertise. The collaboration aims to deliver… |
