Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries.
Digi-Key Electronics announced that it has partnered with Truphone to bring cellular IoT connectivity services to manufacturers worldwide. The partnership will provide customers with connected cellular devices and a fully managed service.
Digi-Key will use Truphone’s state of the art SIM technology, allowing users to connect IoT devices to…
STMicroelectronics announces the availability of a compact and cost-…
As the automobiles are transitioning from mechanical to electrical, the use of ECUs (electronic control units) has increased to a higher percentage. The ECUs in the electric vehicles act as the brainpower of the vehicle and are responsible for all the most important features such as safety with the help of ADAS, precise engine control, connectivity, efficiency, and comfort.…
Infineon Technology has released the second device in the new generation BCR family - BCR431U LED Driver ICs. The new constant current linear LED driver IC provides low voltage drop performance for regulating LED current and it focuses on low current designs of up to 37mA. The IC can have an unmatched voltage drop of 105mV at 15mA in the industry that can provide far…
Canada based I-SYST has come up with a tiny nRF52840 module that is as small as a fingernail. Named BLYST840, the module has 46 I/O, 1 MB flash, 256 kB RAM, is ready for Bluetooth 5.2, is Thread, and ZigBee capable, NFC-enabled, comes with built-in security measures and supports MicroPython. The nRF52840 ARM Cortex-M4F module is feature-rich with ultra-low-power SoM that…
Renesas introduced four new I3C Basic bus extension products that support up to 12.5MHz speeds with integrated thermal sensor capability. The new product series include the IMX3102 2:1 bus multiplexer, suited for designs where there may be two masters controlling a single peripheral or slave devices, the IMX3112 1:2 bus expander that supports designs where a single host…
The robotic fleets are reshaping the logistics, delivery and inspection industry and moving towards enhanced autonomy where there will be no need for human intervention. To support this view, the Wibotic has introduced the wireless charging and power optimization solution for the rapidly growing ecosystem of aerial, mobile, marine, and industrial robots. The new solution…
STMicroelectronics has released three functional-safety packages that simplify the development of safety-critical industrial, medical, consumer, and automotive products based on STM32 and STM8 microcontrollers and microprocessors.
The packages are available free of charge and contain the resources developers need to satisfy applicable IEC and ISO…
Toshiba Electronic Devices & Storage Corporation has added two new interface bridge ICs for automotive In-Vehicle Infotainment (IVI) systems, namely “TC9594XBG (Parallel to MIPI DSI)” and “TC9595XBG (MIPI DSI /DPISM to DisplayPort)” as a lineup to its display interface bridge ICs.
Features of TC9594 and TC9595 Display Driver IC…
OmniVision Technologies has released the CameraCubeChip module named OVM9284. This automotive-grade wafer-level camera is 1 megapixel (MP) module that measures 6.5 x 6.5 mm and provides driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. It is built on OmniVision’s OmniPixel 3-GS global-shutter…
TE Connectivity has introduced a minimal footprint SMI SO-10 pressure sensor package with a vertical port. It is designed with a MEMS pressure sensor and an advanced signal-conditioning IC which is combined to provide fully pressure calibrated and temperature compensated output. The device covers gauge pressure ranges from .5 to 30PSI with a digital (I2C) or dual output (…
Nexperia has introduced the new range of silicon-germanium (SiGe) rectifiers with 120 V, 150 V, and 200 V reverse voltages that deliver high efficiency of their Schottky counterparts along with thermal stability of fast recovery diodes. The new devices are designed to be operated in the automotive, communication infrastructure, and server markets.
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