Electronics and Semiconductor News

Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries. 

 

MAXST, the city-scale augmented reality platform has the newest addition in the family in the form of ‘Sensor Fusion SLAM’ solution that integrates the use of a camera with IMU (Inertial Measurement Unit) sensor. ‘Sensor Fusion SLAM’ technology does not require a LiDAR and ensures to outperform technologies such as ORB-SLAM2 and VinsMono SLAM as suggested in the…

Microchip Technology introduced the LAN8770, an OPEN Alliance TC10 sleep standard Ethernet Physical layer transceiver (PHY) that has four-time lower sleep current (15 µA) than other available devices. The IEEE 802.3bw-2015 specification compliant LAN8770 is a compact, cost-effective, single-port 100BASE-T1 Ethernet PHY packed in a 5x5 mm or 6x6mm wettable-flanks QFN.…

STMicroelectronics is simplifying the complex software challenges that face developers of IoT nodes by introducing the B-L4S5I-IOT01A STM32 Discovery kit. The kit comes with a qualified port of FreeRTOS, fully integrated into the STM32Cube ecosystem, and ready to connect to Amazon Web Services (AWS).

The hardware comprises an…

Linklayer Labs has recently launched an open-source USB CAN tool that lets users debug or hack vehicle components. CAN (Controller Area Network) is a serial communication bus that enables microcontrollers and various components like the dashboard, ABS, air conditioner, and other sensors to communicate with each other without a host computer. Named CANTact Pro, the tool helps…

Diodes Incorporated has introduced the automotive compliant ZXTP56060FDBQ and ZXTP56020FDBQ dual PNP transistor that provides OEMs with a highly efficient solution for controlling matrix LED light clusters. These new transistors were designed to address the demand for the need of dense and highly power-optimized transistors for shunting LEDs in matrix lighting and sweeping…

Designers of wirelessly connected, coin cell-operated internet of things (IoT) products can now reduce bill-of-materials (BOM) costs by one-third while also saving space and battery life with the MAX32666 microcontroller (MCU) from Maxim Integrated Products. This ultra-low-power dual Arm® Cortex®-M4 MCU with floating-point unit (FPU) and Bluetooth Low Energy 5.2 (BLE 5.2)…

STMicroelectronics has announced a wireless M-Bus (wM-Bus) software stack that leverages the integrated sub-GHz radio and multiple modulation schemes supported by STM32WL microcontrollers to cut bill-of-materials cost and enhance flexibility for developers of smart-metering systems.

Developed by Stackforce, the wM-Bus stack complies with…

The Infineon Technologies AG is going to expand its XENSIV 3D magnetic sensor family TLv493D with the introduction of the TLI493D-W2BW. The new sensor uses the latest 3D Hall generation from Infineon and is housed in an extremely small (1.13 mm x 0.93 mm x 0.59 mm) wafer-level (WLB-5) package. The new device has an 87% smaller footprint and 46% lesser height than the…

STMicroelectronics has introduced a new generation of high-accuracy proximity and ranging sensors based on FlightSense Time-of-Flight (ToF) technology. The Proximity sensors use simple Infra-Red technology and directly measure distance based on the time for emitted photons to be reflected, enabling accurate distance ranging regardless of the object’s surface…

Bringing revolution in the LiDAR technology, a team of researchers at the University of Colorado (UC) Boulder has developed a new optical phased array concept, serpentine OPA (SOPA) that could support medium- to long-range LiDAR. The new approach is based on a serially interconnected array of low-loss grating waveguides and supports a fully passive 2D wavelength-controlled…

Power Integrations has introduced the InnoSwitch3-AQ, an AEC-Q100- qualified switcher with integrated 750V MOSFET and secondary-side sensing, designed especially for automotive EV applications, such as traction inverter, OBC (on-board charger), EMS (energy management DC/DC bus converters), and BMS (battery management systems).

The high-speed…

Toshiba Electronic Devices & Storage Corporation has introduced the “TB9120AFTG” a 7 V to 18 V constant current 2 phase stepping motor driver for automotive applications. The new IC gives out a sine-wave current with the help of a simple clock input interface, this eliminates the need for an advanced functional MCU or dedicated software.

The…