Electronics and Semiconductor News

Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries. 

 

NWF has a total outstanding debt of £20 million with HSBC and £18 million with the Welsh government.

Majority shareholder Drew Nelson, the CEO who acquired the business from Infineon four years back will now receive £15 million.

China’s Wingtech that owns the Dutch semiconductor firm Nexperia has now announced that it…

The new PrizmaCap capacitors or SCP series from AVX are the prismatic EDLCs (supercapacitors) that provide the low profile and wide operating temperature available in the market. The extremely lightweight supercapacitors are suitable to be used in SWaP-optimized, battery-powered devices. Used either singularly or in conjunction with primary or secondary batteries, these…

Engineers at the University of Michigan have developed a new ultra-thin silver film-based Nanotech OLED electrode that could free up 20% more light from the organic light-emitting diodes besides lowering down the display power consumption. This new electrode with a five-nanometer-thick layer of silver and copper outperforms conventional indium tin oxide without…

Melexis has introduced a free, online simulation tool for magnetic sensor evaluation and module design. The online tool gives customers’ engineering teams the ability to design and simulate their own magnets based on Melexis’ Triaxis® 2D/3D sensors. By using the simulation application, engineers can quickly design a custom magnetic sensor module to their own specification.…

Bringing new possibilities for space-constrained cellular IoT, SIMCom in collaboration with Infineon and Kigen has introduced a new SIM7070 series NB-IoT module in a compact footprint (24 mm x 24 mm). Combining GSMA-compliant eSIM remote management from Kigen with a high eSIM security controller from Infineon, this compact module is optimized for space-constrained…

Nexperia has developed small and low profile 14, 16, 20, and 24 pin DHXQFN packages to provide a small footprint in standard logic devices. Measuring just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin), and 2 mm x 4 mm (24 pin), the 0.4 mm pitch, 0.45 mm height, these DHXQFN packages help in saving space on PCB.

The 16 pin…

The next generation MAX25405 infrared-based dynamic optical sensor from Maxim Integrated detects wider proximity of movement and doubles the sensing range to 40cm besides offering 10x lower cost than time-of-flight (ToF) camera-based systems in automotive, industrial, and consumer applications. This new sensor with integrated optics and a 6 x 10 infrared sensor array…

The innovative digital Zero Voltage Switching (ZVS) chipset from Dialog Semiconductor enables designers to reduce component size and BOM cost for delivering small form-factor, lightweight power supplies, including travel adapters for smartphones, tablets, laptops, power tools, and other portable devices. Targeting high power density PSUs with Zero Voltage switching…

Ensuring to optimize system efficiency and extend industrial and automotive system lifetimes, the two new humidity sensors, HDC3020 and HDC3020-Q1 from Texas Instruments provide high reliability and built-in resistance to contaminants and harsh environments. With extremely high accuracy and low power, these new humidity sensors offer improved relative humidity…

Expanding its range of TVS (transient voltage suppression) diodes, TDK Corporation has introduced two new micro-packaged TVS diodes designed specifically to protect voltage-sensitive components from ESD for existing and future applications within IoT, smart home, or Industry 4.0. The new compact TVS diodes - SD01005SL-ULC101 (B74111U0033M060) and SD0201SL-ULC101 (…

The bounce back of the economy from the constraint of the pandemic has augmented the demand for electronic components Intel spend heavily to build new factories specifically to act as foundries that make chips for others

Amid the escalating tensions concerning the global shortages of semiconductors, CEO of Intel Corp, Pat Gelsinger has now speculated that the shortage,…

Car makers in the US are requesting the government to permit chipset fabs to produce a few volumes of chips for their exclusive use.

At first, TSMC will give preference to Apple’s chip and integrated circuits, which will be then followed by orders from server and PC makers.

The Taiwanese global semiconductor…