To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Infineon Technologies AG has expanded its portfolio of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and…
Infineon Technologies AG has announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN TM devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications that help drive digitalization and decarbonization. With this, Infineon expanded its CoolGaN…
Diodes Incorporated has introduced four new additions to its popular DML30xx series smart load switches: DML3008LFDS, DML3010ALFDS, DML3011ALFDS, and DML3012LDC. These devices offer control over high-current (ranging from 10.5A to 15A) power domain switching for voltage rails spanning from 0.5V to 20V. They're engineered to efficiently manage power delivery to a…
STMicroelectronics has launched the new EVSPIN32G4-DUAL demonstration board that controls two motors from a single STSPIN32G4 integrated driver, accelerating product development and simplifying the PCB design and bill of materials. The EVSPIN32G4-DUAL board cuts the time to market for advanced industrial and consumer products such as robots,…
Nexperia has introduced its latest innovation in power electronics, announcing the availability of 1200 V silicon carbide (SiC) MOSFETs in D2PAK-7 surface mount device (SMD) packaging. With RDS (on) values ranging from 30 to 80 mΩ, this release marks a significant expansion of Nexperia's SiC MOSFET portfolio. Following the introduction of SiC MOSFETs in TO-247…
Infineon Technologies has introduced the new XENSIV TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. These sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling. All products in the XENSIV TLE49SR family withstand stray…
Qorvo has introduced the industry’s first single-chip variable inverse cable equalizer, the QPC7330. This IC is designed specifically for CATV application developers aiming to upgrade their networks to the advanced DOCSIS 4.0 standard, facilitating symmetrical multi-gigabit speeds over cable’s hybrid fiber coax (HFC) networks. The QPC7330 simplifies field…
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, has released a new eBook in collaboration with Vishay Intertechnology, Inc., analyzing the considerations and challenges of designing high-performing and reliable battery systems.
The eBook, 8 Industry Experts Discuss…
Microchip Technology has announced a new family of Radiation-Tolerant (RT) LE50-28 isolated DC-DC 50W power converters available in nine variants with single- and triple-outputs ranging from 3.3V to 28V. The off-the-shelf LE50-28 family of power converters are designed to meet MIL-STD-461. The power converters have a companion EMI filter and…
STMicroelectronics has launched a new module called the ASM330LHBG1, which has two main components: a 3-axis accelerometer and a 3-axis gyroscope. This module is designed specifically for use in cars and comes with software that helps ensure safety in different car functions. The module is built to work in tough conditions, like really hot or cold temperatures,…
Diodes Incorporated brings extra convenience and performance to state-of-the-art in-car connectivity with the introduction of its 10Gbps automotive-compliant PI3USB31532Q crossbar switch. Designed for routing USB 3.2 and DisplayPort 2.1 signals through a USB Type-C® connector, this new switch ensures high signal integrity and saves power compared to a…
Microchip Technology has introduced the RT PolarFire® system-on-chip (SoC) FPGA, designed for aerospace applications. This FPGA offers real-time Linux® capabilities and is based on the RISC-V® architecture. It provides high performance, reliability, power-efficiency, and security against space-related threats. The RT PolarFire SoC FPGA features a multi-core Linux-…
