Toshiba's Thermoflagger ICs: Detecting Temperature Rises with Precision

Published  September 14, 2023   0
S Staff
Thermoflagger ICs for Detecting Temperature Rises

Toshiba Electronic Devices & Storage Corporation has unveiled an extended range of their innovative "TCTH0xxxE series" Thermoflagger over-temperature detection ICs. These cutting-edge components are designed to work seamlessly with positive temperature coefficient (PTC) thermistors in electronic equipment, providing a simple yet effective solution for monitoring temperature rises. Ensuring that semiconductors and electronic components remain within their specified operating parameters is critical for safety and reliability. The Thermoflagger™ ICs excel at this task by detecting temperature fluctuations and resistance changes in PTC thermistors located near heat sources. When an abnormal temperature rise is detected, the ICs send a FLAG signal to the microcontroller unit (MCU), enabling actions such as shutting down the equipment or adjusting the operation of heat-generating components.

The latest additions to the TCTH0xxxE series, including models TCTH011AE, TCTH012AE, TCTH021AE, TCTH022AE, TCTH011BE, and TCTH012BE, expand the product line to a total of eight options. These new arrivals offer enhanced flexibility with support for two types of PTCO output current, as well as the choice between push-pull or open-drain FLAG signal output types and the option to use or omit a FLAG signal latch function. The ICs are conveniently packaged in the industry-standard SOT-553, making it easier for designers to integrate over-temperature detection into their electronic equipment while reducing size and power consumption. Toshiba has also made reference designs available on their website, simplifying the implementation process.

Toshiba's collaboration with Murata Manufacturing Co., Ltd. further enhances the Thermoflagger solution, as Murata recommends its PTC thermistors for use with these ICs. Toshiba remains committed to expanding its product line, with a focus on different packages and improved device characteristics that promote design flexibility and contribute to carbon neutrality in electronic equipment.