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Processors for Performance and Safety for Next-Generation Electric and Autonomous Vehicles Processors for Performance and Safety for Next-Generation Electric and Autonomous Vehicles

NXP has announced a new family of high-performance safe microprocessors to control vehicle dynamics in next-generation electric…

Low-Power Single-Channel 16-Bit DAC Analog Devices’ Low-Power, Single-Channel 16-Bit DAC Enables High Density Analog Output Modules without De-Rating

Analog Devices presented the AD5758 DAC (Digital-to-Analog Converter), which includes company’s second-generation DPC (Dynamic Power Control).…

5.5-V DC/DC step-down power module TI's ultra-small 5.5-V DC/DC step-down power module delivers true 6A performance

Highly integrated synchronous power module features up to 95 percent efficiency for space- and height-constrained applications…

Highly Efficient Single-Chip Three-Phase and Three-Sense BLDC Driver Boosts Runtime from Batteries Low Voltage BLDC Motor Driver to Increase Battery Runtime in Portable Devices

STMicroelectronics launches its first low voltage motor driver named STSPIN233, suitable for both single and three…

LTM4661 Tiny uModule Low Voltage Regulator Analog Devices’ Tiny µModule Boost Regulator for Low Voltage Optical Systems

Analog Devices launched LTM4661 a low power step-up µModule regulator in an ultrathin size 6.25mm x 6.25mm x 2.42mm BGA package…

 Samsung's New Chip Scale LED Package Samsung Enhances Chip-Scale LED Package Lineup with Industry’s Highest Luminous Efficacies

Samsung achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B,…

Innovative Low-Dropout Voltage Regulator from STMicroelectronics Low-Dropout Voltage Regulator from STMicroelectronics Packs Big Performance in Tiny Footprint

STLQ020 trade-offs between quiescent current, output power, dynamic response and package size to give designers extra freedom…

X-Class CMOS Image Sensor Platform X-Class CMOS Image Sensor Platform from ON Semiconductor Enables New Functionality for Industrial Camera Design

X-class image sensor platform permits the camera design to enable not only multiple product resolutions but also the different…

Texax New Flyback Chipsets New 1-MHz active clamp flyback chipset and industry-first 6-A three-level buck battery charger cut power supply size and charge time in half

Texas Instruments introduces new power management chips that allow the engineers to boost efficiency and shrink the power…

Toshiba Develops Ultra-low-power Analog AI Accelerator Chip for Embedded Systems Toshiba Develops Ultra-low-power Analog AI Accelerator Chip for Embedded Systems

Analog AI Accelerator Chip will accelerate the origination of AI technologies into embedded devices which have been difficult…