Automotive
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Infineon and Flex launch Zone Controller Development Kit for software-defined vehicles at CES 2026 Munich, Germany – 02 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Flex take the next step in their collaboration to… |
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Cyient Semiconductors Announces Agreement to Acquire Controlling Stake in Kinetic Technologies Cyient Semiconductors has entered into an agreement to acquire a controlling stake in Kinetic Technologies. Expected to close in the months ahead… |
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Suchi Semicon's New QFN and Power Package Families to Reduce India's Dependency on External Suppliers Suchi Semicon announced the addition of new QFN (Quad Flat No-lead) and Power Package families to its portfolio. The QFN types include QFN, uQFN,… |
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Cyient Joins GlobalFoundries’ Channel Network to Offer Advanced Chip Services Cyient Semiconductors signed a channel partner agreement with GlobalFoundries (GF), which makes it an authorized reseller of GF’s semiconductor… |
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Vishay’s New IHDM Inductors Deliver 30% Higher Current Performance for Automotive Applications Vishay Intertechnology has introduced two new automotive-grade inductors. Both IHDM-1107BBEV-2A and IHDM-1107BBEV-3A come in a 1107 case size with… |
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Vishay Launches 1500 W TVS Diodes in Compact SMB Package for Automotive Applications Vishay Intertechnology has released a new series of surface-mount transient voltage suppressors (TVS) that are rated at 1500 W. Designed for… |
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Tata Electronics and Bosch Sign MoU for Collaboration in Chip Manufacturing and Automotive Electronics To collaborate on key areas in semiconductor manufacturing and automotive electronics, Tata Electronics and Robert Bosch GmbH have signed a… |
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Vishay Introduces 0402 Case Size in CHA Series Resistors, AEC-Q200 Qualified Vishay Intertechnology has announced an expansion of its CHA series of thin film chip resistors. The resistors, being AEC-Q200 qualified, meet… |
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Cadence and Samsung Foundry Sign Multi-Year Deal for Advanced Chip Design Cadence and Samsung Foundry have entered a new multi-year agreement, continuing their current collaboration. The partnership is directed towards… |
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Cyient and MIPS Collaborate on Domain-Optimized Semiconductor Platforms Cyient Semiconductors and MIPS have announced a strategic collaboration to develop ASIC and ASSP solutions using MIPS Atlas processor IP. They aim… |
