Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries.
Espressif introduces the ESP32-based AI voice assistant with on-device processing by the ESP32 Private Agents Platform. It helps developers and students to build customizable AI assistants for the ESP32. The traditional way, which is the embedded AI assistant, requires stitching together multiple complex components such as cloud backends, device firmware, and speech recognition. ESP32…
India has marked an important step in its semiconductor roadmap with the launch of DHRUV64, the country’s first fully indigenous 1.0 GHz, 64-bit dual-core microprocessor. Developed by the Centre for Development of Advanced Computing (C-DAC) under the Microprocessor Development Programme, DHRUV64 is designed to serve both strategic and commercial needs. The processor is part of India’s broader…
Quarky Intellio is a LEGO-compatible AI module made for hands-on learning in Artificial Intelligence, Augmented Reality, and Robotics. It is built on the ESP32-S3 microcontroller and includes a camera, microphone, speaker, rechargeable battery, SD card slot, and multiple connection ports. These features allow users to experiment with vision, sound, and basic edge AI projects using a small, all…
Virtusa has announced the acquisition of SmartSoC Solutions, the final piece that completes its full-stack capabilities. The company’s portfolio now covers everything from chip design to cloud applications. The deal adds over 1,400 of SmartSoC’s engineers to Virtusa, bringing deep expertise in VLSI, physical design, and embedded software.
This puts Virtusa in a position to tap into the…
NeST Group’s flagship company, SFO Technologies, exchanged a memorandum of understanding (MoU) with the Tamil Nadu government at the TN Rising Conclave in Madurai. The MoU is for its plans to establish a greenfield electronics manufacturing facility in Theni, Tamil Nadu. The exchange happened in the presence of Chief Minister M.K. Stalin and Industries Minister Dr T.R.B. Rajaa.
The…
Engineers from MIT have developed aerial microrobots that are roughly 450% faster with about 250% better acceleration in comparison to prior demos. “We want to be able to use these robots in scenarios that more traditional quadcopter robots would have trouble flying into, but that insects could navigate,” said Kevin Chen, an associate professor at MIT.
The robot's controller is…
Suchi Semicon announced the addition of new QFN (Quad Flat No-lead) and Power Package families to its portfolio. The QFN types include QFN, uQFN, DFN, and XFN options, whereas the Power Package types comprise DPAK, TO-series and IPAK options. This move helps avoid dependency on external suppliers by satisfying the package requirements of Indian chip designers and product manufacturers in-house…
DigiKey, the leading global electronic components and automation products distributor, is offering a free webinar with supplier Hirose about humanoid robotics on Dec. 10 at 10 a.m. CST. The one-hour virtual event will cover design priorities, common pitfalls and connector solutions that are enabling the latest advancements in humanoid robotics.
The global humanoid robot market is…
The Drone Pro Hub team recorded their drone reaching a top speed of 605 km/h. The feat was the outcome of an 18-month effort headed by FPV specialist Benjamin Biggs. The quad-rotor drone, mounted on a base for take-off, featured onboard GPS telemetry that allowed speed monitoring.
While not recognized as an official record, they tested the right way and calculated the average speed of…
At a handover ceremony during his visit to the Semi-Conductor Laboratory (SCL), Mohali, for a review, Ashwini Vaishnaw, Union Minister for Electronics & Information Technology, delivered 28 chips designed by students from 17 academic institutions. The fabricated chips included 600 bare dies and 600 packaged chips. This was made possible by the Chips to Start-up (C2S) Programme.
A…
AAEON has released the COM-ARHC6, a COM Express Type 6 Computer-on-Module (COM). It features Intel® Core™ Ultra Series 2 processors, offering choices including Intel® Core™ Ultra 9 Processor 285H, Intel® Core™ Ultra 7 Processor 255H, and Intel® Core™ Ultra 5 Processor 225H. As these processors come with an integrated Intel® Arc™ GPU and an Intel® AI Boost NPU, the module is capable of reaching…
Bengaluru-based SignOff Semiconductors, partnering with MosaIC, has established a sales office in Israel. SignOff positions itself as a design partner primarily focused on VLSI. They help chipmakers through initial specifications to final tape-out, working across process nodes, including 2nm. As part of the tie-up, MosaIC will represent the company locally and help drive customer relationships…
