Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries.
Toshiba Electronic Corporation has announced the TC78B009FTG, a three-phase Brushless motor control pre-driver IC that does not require the Hall sensor for closed-loop speed control. The advancements in server capacity and performance require larger and high-velocity fans for cooling the excess heat generated by the equipment. Similarly, blowers, vacuum cleaners, and pumps…
STMicroelectronics introduced two $99 ready-to-use development packs that enable all types of users from large corporations to smaller companies, independent designers, hobbyists, and schools to utilize long-range, low-power wireless IoT connectivity for tracking, positioning, metering, and many other applications.
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Mouser Electronics announces a new eBook in collaboration with NXP Semiconductors, examining the myriad potential applications of artificial intelligence (AI) and identifying specific products for AI and machine learning (ML) solutions. In Imagine the Possibilities, experts from both Mouser and NXP offer in-depth analysis of hot-button AI applications, including voice…
The Renesas Electronics Corporation has introduced the RL78/G14 Fast Prototyping Board, a low cost, function-rich board that can enable rapid product development for IoT endpoint equipment. The low cost and quick development prototyping gives users the agility to respond to rapid changes in technology and market needs and reduces the time to market for new products. With the…
OKdo, part of Electrocomponents plc, introduced the NVIDIA Jetson Nano Developer Kit which comes with out-of-the-box support for full desktop Linux, compatible with many peripherals and accessories, ready-to-use projects and tutorials to help makers get started. The Jetson platform brings once unimaginable artificial intelligence (AI) applications within the reach…
Diodes Incorporated introduced the PAM8904E, an enhanced version of its popular sound driver that delivers higher performance at lower voltage in a smaller package for small and portable devices. The driver can support both single-ended and differential output modes with minimal external components.
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CUI announced the addition of six low power, open frame ac-dc power supply series to its VOF product family. The VOF-15C, VOF-30C, VOF-40C, VOF-45C, VOF-60C and VOF-65C are 15, 30, 40, 45, 60 and 65 W additions to CUI’s general purpose ac-dc power supply portfolio now ranging from 3 W to 550 W. Housed in compact, chassis mount packages measuring as small as 2.5 x 1.8 x…
Microchip Technology has introduced a new family of Serial Peripheral Interface (SPI) EERAM memory products that can automatically restore the content if the power is disrupted during the processing in applications that require repetitive task data logging. The current low density nonvolatile serial RAM (NVRAM) solutions used for these data logs are at a higher cost per…
Toshiba Electronics has started shipping two eFuse ICs (TCKE805NA and TCKE805NL) from TCKE8xx Series, a series of six new eFuse ICs. These eFuse ICs overcome one of the biggest hurdles of the conventional glass tube fuses and chip fuses by offering reusable ability. The conventional fuses need to be replaced once they are broken, but the eFuse IC products use their own…
Until now, accurate blood-pressure monitoring could only be achieved with bulky and mechanical cuff-based medical devices. Now, Maxim Integrated introduced a solid-state blood-pressure monitoring solution to more conveniently track this critical health indicator. Design engineers can develop blood-pressure trending solutions with the MAXREFDES220# reference design from…
Semtech Corporation introduced the 36V TClamp3602P that offers protection for industrial applications against surge and electrostatic discharge (ESD) in a small leadless package. This Transient Voltage Suppression (TVS) array is optimized to protect the industrial data interfaces such as RS-485 and CAN from dangerous transient threats and also minimizes the capacitive…
Infineon Technologies expands its product portfolio of thyristor/diode module with the new Prime Block 50mm modules which feature solder bond technology and 60mm modules pressure contact technology. These Prime Blocks are designed for higher performance when the desired current exceeds 600A for a 60mm footprint or 330A for a 50mm footprint. This avoids the paralleling of…
