Electronics and Semiconductor News

Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries. 

 

OKdo, part of Electrocomponents plc, introduced the NVIDIA Jetson Nano Developer Kit which comes with out-of-the-box support for full desktop Linux, compatible with many peripherals and accessories, ready-to-use projects and tutorials to help makers get started. The Jetson platform brings once unimaginable artificial intelligence (AI) applications within the reach…

Diodes Incorporated introduced the PAM8904E, an enhanced version of its popular sound driver that delivers higher performance at lower voltage in a smaller package for small and portable devices. The driver can support both single-ended and differential output modes with minimal external components.

 

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CUI announced the addition of six low power, open frame ac-dc power supply series to its VOF product family. The VOF-15C, VOF-30C, VOF-40C, VOF-45C, VOF-60C and VOF-65C are 15, 30, 40, 45, 60 and 65 W additions to CUI’s general purpose ac-dc power supply portfolio now ranging from 3 W to 550 W. Housed in compact, chassis mount packages measuring as small as 2.5 x 1.8 x…

Microchip Technology has introduced a new family of Serial Peripheral Interface (SPI) EERAM memory products that can automatically restore the content if the power is disrupted during the processing in applications that require repetitive task data logging. The current low density nonvolatile serial RAM (NVRAM) solutions used for these data logs are at a higher cost per…

Toshiba Electronics has started shipping two eFuse ICs (TCKE805NA and TCKE805NL) from TCKE8xx Series, a series of six new eFuse ICs. These eFuse ICs overcome one of the biggest hurdles of the conventional glass tube fuses and chip fuses by offering reusable ability. The conventional fuses need to be replaced once they are broken, but the eFuse IC products use their own…

Until now, accurate blood-pressure monitoring could only be achieved with bulky and mechanical cuff-based medical devices. Now, Maxim Integrated introduced a solid-state blood-pressure monitoring solution to more conveniently track this critical health indicator. Design engineers can develop blood-pressure trending solutions with the MAXREFDES220# reference design from…

Semtech Corporation introduced the 36V TClamp3602P that offers protection for industrial applications against surge and electrostatic discharge (ESD) in a small leadless package. This Transient Voltage Suppression (TVS) array is optimized to protect the industrial data interfaces such as RS-485 and CAN from dangerous transient threats and also minimizes the capacitive…

Infineon Technologies expands its product portfolio of thyristor/diode module with the new Prime Block 50mm modules which feature solder bond technology and 60mm modules pressure contact technology. These Prime Blocks are designed for higher performance when the desired current exceeds 600A for a 60mm footprint or 330A for a 50mm footprint. This avoids the paralleling of…

According to a new market report pertaining to the global wireless connected devices market, the global wireless connected devices market is projected to reach a volume of 5 billion units by 2027. The wireless connected devices market is projected to expand at a CAGR of ~8% from 2019 to 2027. Growth of the wireless connected devices market can be…

Diodes incorporated had announced the release of dual role PI3USB9201 USB BC 1.2 detector that has both host and client circuitry, it helps the designers to optimize the BoM size and cost of adding USB Type-C interface circuitry in the electronic devices. The available market solutions require devices to dedicate themselves to either host or client mode, but the PI3USB9201…

Renesas Electronics Corporation has announced the development of R-IN32M4-CL3 IC for Industrial Ethernet (IE) Communication; it delivers support for CC-Link IE Time-Sensitive Networking (TSN), a communication standard for next-generation Ethernet TSN technology. The R-IN32M4-CL3 is the first controller that supports CC-Link IE TSN which enables high speed and high precision…

Integrated Device Technology (IDT) launched the ZSSC3230, a new energy efficient and highly precise 18-bit sensor signal conditioner (SSC) for capacitive sensor applications. Its combination of best-in-class signal conditioning, low power consumption and small size makes it ideal for use with humidity, pressure, level and other smart capacitive sensor modules that…