Find the latest electronics industry news covering new electronics components releases in various electronics domains such as embedded, power electronics, analog, digital, IoT and Automotive industries.
The next-generation i.MX 9 series of high-performance intelligent applications processors from NXP Semiconductors make deploying security, energy efficiency, and scalability for the industrial and IoT edge easy. The new processors from the company are part of the expansion of its EdgeVerse portfolio of crossover applications processors, including i.MX 8ULP and…
MG800FXF2YMS3, a silicon carbide (SiC) MOSFET module from Toshiba Electronic Devices integrates newly developed dual-channel SiC MOSFET chips with 3300V and 800A rating for industrial applications. These new SiC MOSFET modules contribute to the high efficiency and miniaturization of industrial equipment.
The product adopts an iXPLV (intelligent…
Renesas Electronics Corporation and LUPA-Electronics GmbH have collaboratively introduced the EagleCAM module, an open front camera solution that significantly shortens time to mass production of Euro NCAP, C-NCAP, and L2+ applications. Featuring Renesas’ R-Car V3H and R-Car V3M system-on-chip (SoC) devices, this all-in-one scalable camera platform enables OEMs and Tier 1s…
Designers can now achieve double the battery life together with robust protection and highest accuracy for the internet of things (IoT), industrial and healthcare applications with three new Essential Analog ICs from Maxim Integrated Products namely the MAX41400 instrumentation amplifier, MAX40108 precision operational amplifier, and MAX31343 real-time clock (RTC) with…
Microchip’s SA50-120 series is the family of space-qualified COTS-based radiation-hardened DC to DC power converters that help minimize risk and lower development costs in space applications. Offering eight million hours Mean Time Between Failure (MTBF) and up to 87% efficiency, the SA50-120 power converters maximize system performance and reliability.
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A17700 from Allegro is an automotive-grade interface IC that delivers fast, reliable, and flexible output with top-of-the-line signal conditioning algorithms for automotive and industrial pressure sensing applications. This new IC is configurable for resistive bridge pressure sensors in a wide range of critical applications viz. high-pressure systems like dynamic brake…
Texas Instruments has released DRV3255-Q1, a highly integrated Grade 0 brushless DC (BLDC) motor driver for 48-V high-power motor control systems like traction inverters and starter generators in mild hybrid electric vehicles (MHEVs). This new motor driver integrates active short-circuit logic and dynamic fault response. It enables designers to simplify their designs and…
Maxim Integrated Products has announced that its dual IO-Link products have been adopted by OMRON Corporation for the company’s NXR-Series IO-Link Controller and IO-Link I/O hubs, expanding its IO-Link bi-directional controller and digital IO capabilities. NXR-Series give OMROM customers a new way to add IOs to factory automation systems and bring intelligence to the edge of…
Designed to write sensor readings to a secure blockchain, Pebble Tracker from IoTeX is a secure, battery-operated, multi-sensor, cellular-IoT prototyping platform that uses a tamper-proof secure element to convert real-world phenomenon into verifiable, blockchain-ready data. This new prototyping platform is built around Nordic Semiconductor’s latest low-power nRF9160 System-…
The new silicon carbide (SiC) MOSFETs from On Semiconductor deliver high switching, improved reliability, and improved power density in various industrial and automotive applications. The NVBG015N065SC1, NTBG015N065SC1, NVH4L015N065SC1, and NTH4L015N065SC1 automotive AECQ101 and industrial-grade qualified 650 volt (V) SiC MOSFETs come in D2PAK7L and To247 packages and…
ROHM Semiconductor has recently announced that Embedded Artists is using their highly integrated PMIC, BD71847AMWV along with i.MX 8M Nano from NXP on the new iMX8M Nano uCOM board to deliver a robust and cost-effective solution for industrial applications. This new uCOM board measures 45mm x 42mm and features the i.MX 8M Nano processor with Quad-core ARM Cortex-A53 and…
GeneSiC Semiconductor’s new third-generation 1200V G3R SiC MOSFETs with low on-state resistance and best figure-of-merits can surpass its currently available options in terms of performance, robustness, and quality to harness extremely high levels of efficiency and system reliability in automotive and industrial applications. Faster switching frequency, increased power…
