To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
On semiconductors released a new System-in-Package (SiP) Module RSL10, extending its Bluetooth® 5 Radio Family. The RSL10 SIP…
RECOM introduced new encapsulated 5W power supply modules which operate up to an impressive +90°C. These modules accept input…
Molex released Hybrid FTTA-PTTA Optical Cable Solutions for cell phone towers to allow for maximized tower real…
Infineon Technologies AG is introducing the IRS2007S 200 V half-bridge gate driver IC in a standard SOIC-8 (DSO-8) package. It…
Intel has announced two new 8th generation processors U- series and Y-series. The U-series (formerly code-named Whiskey Lake)…
Recent developments in the automotive industry require increasingly faster communication capabilities. Originally, the CAN FD…
Infineon Technologies and Zylia, a Poland-based developer of recording technologies, have enabled the world’s first portable…
Designers of lithium-ion (Li-ion) battery-powered mobile and portable devices such as wearables, electric bicycles, power tools…
The STSPIN830 and STSPIN840 single-chip drivers from STMicroelectronics contain flexible control logic and…
To address the increasing demand of high voltage MOSFETs, Infineon Technologies introduce a new member of its CoolMOS™…
Samsung Electronics announced its new narrowband Internet of Things (NB-IoT) solution, Exynos i S111 which provides…
Toshiba Carrier Corporation established a new joint venture - Toshiba Carrier Air-Conditioning India Private Ltd, with Gurgaon…
