To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
The STSPIN830 and STSPIN840 single-chip drivers from STMicroelectronics contain flexible control logic and low-RDS(ON) power…
To address the increasing demand of high voltage MOSFETs, Infineon Technologies introduce a new member of its CoolMOS™ P7…
Samsung Electronics announced its new narrowband Internet of Things (NB-IoT) solution, Exynos i S111 which provides wide…
Toshiba Carrier Corporation established a new joint venture - Toshiba Carrier Air-Conditioning India Private Ltd, with Gurgaon…
Maxim’s new IC MAX20069, which integrates four I2C-controlled, 150mA LED backlight drivers and a four-output thin-film-…
Molex introduce a Coeur CST High-Current Interconnect System featuring a unique new float design that accommodates pin to…
A new series of next-generation 650V power MOSFETs was announced by Toshiba, that are intended to be used in server power…
Maxim Integrated introduced a new robust and reliable 5kVRMS four-channel reinforced digital isolator MAX22445 to facilitate…
Vishay Intertechnology released its first device in new IHSR series of high temperature commercial inductors. Designed for…
STMicroelectronics released a new plug-and-play wireless battery charger development kit STEVAL-ISB045V1 for small IoT devices…
Infineon Technologies introduces the next generation TRENCHSTOP™ IGBT6 for small motor drives up to 1 kW. With a 650 V blocking…
Diodes Incorporated released AP72200, a high-current synchronous buck/boost DC-DC converter with integrated high-side and low-…
