Infineon Technologies
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High-Resolution ToF 3D Image Sensor Brings Accurate and Robust Depth Sensing Capabilities to Automotive Applications Infineon Technologies AG has developed the second generation of the REAL3 automotive image sensor IRS2877A, an ISO26262-compliant high-resolution 3D image sensor that comes in a 9 x 9 mm² plastic BGA package and offers a VGA system resolution of 640 x 480 pixels with a tiny image circle of 4 mm. The high resolution of this sensor makes it suitable… |
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High Performance Analog and Digital XENSIV MEMS Microphones for Consumer Electronics Infineon Technologies AG has launched next-generation XENSIV MEMS microphones IM69D127, IM73A135, and IM72D128 that are designed to capture audio signals with the highest precision and quality and are based on Infineon’s latest Sealed Dual Membrane (SDM) MEMS technology which delivers high ingress protection (IP57) at a microphone level.… |
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NVIDIA Jetson Edge AI Platform with AIROC Wi-Fi and Bluetooth Connectivity Solutions Infineon Technologies AG has announced that it is bringing its AIROC Wi-Fi and Bluetooth connectivity solutions to the NVIDIA Jetson edge AI platform which is a leading AI-at-the-edge compute platform with over one million developers. With pre-trained AI models, developer SDKs, and support for cloud-native technologies across the full Jetson… |
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Multitopology Dual-Channel Boost Controller with Spread Spectrum Frequency Modulation for LED Drivers Infineon Technologies AG has expanded the LITIX Power family with the dual-channel, stand-alone DC-DC controller TLD6098-2ES that can drive a full LED headlamp by itself without an additional microcontroller and can also operate the four standard LED front light functions: High Beam (HB), Low Beam (LB), Daytime Running Lights (DRL) and Turn… |
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New Battery Management ICs Offer an Optimize Solution for Cell Monitoring and Balancing Infineon Technologies AG has introduced a new family of battery management ICs that enables an optimized solution for battery cell monitoring and balancing. Combining excellent measurement performance with the highest application robustness, these new battery management ICs are suitable for a wide range of industrial, consumer, and automotive… |
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New Three-phase Intelligent Power Module Series for Maximum Efficiency and Design Flexibility Infineon Technologies AG has extended the CIPOS Tiny Intelligent Power Module (IPM) family with the new CIPOS Tiny IM323-L6G 600V 15A which is based on TRENCHSTOP IGBT RC-D2 switches and state-of-the-art SOI gate driver technology to realize maximum efficiency and improved reliability, along with minimized system size and cost. This new module is suitable for major… |
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Serial Interface Ferroelectric RAM Provides 2 Mb Density Non-Volatile Storage for Extreme Environments Infineon Technologies LLC has announced the availability of new radiation-hardened (rad-hard), serial interface Ferroelectric RAM (F-RAM) that delivers unsurpassed reliability and data retention and is more energy-efficient than non-volatile EEPROM and serial NOR Flash devices for space applications. This new device is ideal for data logging of mission-critical data,… |
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New Power Semiconductors with CoolSiC MOSFET Tailored Specifically to the Requirements of Rail Services Infineon Technologies AG has announced the launch of its new power semiconductors with CoolSiC MOSFET and .XT technology in the XHP 2 package tailored specifically to the requirements of rail services. In this XHP 2 power module, CoolSiC MOSFET chips enable low conversion losses while maintaining high reliability and are the basis for increased energy efficiency and are… |
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New Wireless Portfolio with Bluetooth LE & 802.15.4 SoC Supports Matter with Multiprotocol Solutions Infineon Technologies AG has launched the new wireless portfolio AIROC CYW30739 Bluetooth LE & 802.15.4 System on Chip (SoC) that enhances the performance of smart home products with seamless interoperability, while enabling end-to-end encrypted communication between individual devices in a Matter network. This new device offers superior RF performance for robust… |
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OptiMOS 6 Power MOSFET 100V Technology with Low On-State Resistance for High Switching Frequency Applications Infineon Technologies AG has introduced the OptiMOS 6 100V family of MOSFETs that comes with improved R DS(on) and combines the benefits of low on-state resistance and superior switching performances. This new technology is specifically optimized for high switching frequency applications such as telecom and solar. Moreover, with wider safe… |
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Sterling-LWB5+ USB Adapter for Reliable Connectivity in Harsh Industrial IoT Applications Expanding the Sterling-LWB5+ module family, Laird Connectivity has introduced a new adapter that is designed specifically to meet the medical and industrial IoT connectivity demands. Housed in a compact, a rugged enclosure measuring 12 mm x 17 mm, the new Sterling-LWB5+ USB Adapter is one secure, high-performance solution that provides easy integration with… |
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EconoDUAL 3 Portfolio Enhanced with New Current Ratings for Increased Power Density and Performance Infineon Technologies has enhanced its 1200 V EconoDUAL 3 portfolio with the TRENCHSTOP IGBT7 chip by offering new current ratings from 300 A to 900 A. The broad range of current offers inverter designers a high degree of flexibility along with increased power density and performance. Featuring new current ratings, these new devices are suitable to be used in solar, drive… |
