Delivering 440 W of power typically requires sophisticated resonant topologies, but Power Integrations (PI) has changed that with its TOPSwitchGaN flyback IC family, based on its PowiGaN tech and TOPSwitch architecture. These ICs featuring 800 V PowiGaN switches make designing circuits easier for engineers and often remove the need for a heat sink through cooler operation. Gallium nitride (GaN) switches with their lower on-resistance (RDS(ON)) help extend the power capability of flyback converters to levels previously difficult with silicon by conducting more cleanly.
The ICs deliver 92% efficiency across the full load range, from 10% to 100% load. Operating at switching frequencies of up to 150 kHz, they also allow for a smaller transformer, reducing the overall footprint of the power supply. Silvestro Fimiani, director of product marketing at Power Integrations, said, “For decades, designers have had to move to resonant topologies like LLC as power levels increased. With TOPSwitchGaN, we’re pushing flyback into a power range previously not possible, allowing engineers to achieve high efficiency and performance with a far simpler architecture.”
TOPSwitchGaN flyback ICs come in an eSOP-12 surface-mount package and a vertical eSIP-7 package. Mounting a simple clip-on heat sink extends the power range up to 440 W. Both are pin-to-pin compatible with PI’s existing TinySwitch-5 ICs, meaning engineers can use them without redesigning their circuits. Priced from $1.00 for 10,000 units, the ICs are also supported by three reference designs spanning 60 W to 356 W.
