To facilitate the fast-growing electronics industry, the semiconductor companies and component manufacturers constantly improve their designs and announce new products and components that are smaller, more efficient and powerful than the exiting ones. This section covers all the latest electronic components introduced in the market to enable design engineers to be aware about the latest options and helping them to keep their designs up-to-date for competing in the ever-evolving market.
Panasonic Industry has launched a new Bluetooth 5.0 Low Energy module called PAN1780 based on the Nordic nRF52840 SoC single-chip controller. The module is powered by a Cortex M4F Processor, with 256kB RAM and 1MB Flash memory, it also has a high sensitivity and output power of +8 dBm making it suitable for long-range applications. Furthermore, the module can broadcast a…
Sensirion has added two new airflow sensors namely, SDP821 & SDP831 to its SDP800 series of differential pressure sensors. These new differential pressure sensors can be used in critical applications since they were developed and certified in accordance with the GAR standards (Gas Appliances Regulations). These sensors can act as a reliable and precise airflow…
Infineon Technologies have introduced OPTIREG TLS715B0NAV50, a flip chip-based linear voltage regulator. With flip-chip technology, the ICs are installed upside down in the package so that the heated part of the IC will be facing the bottom of the package. This way, the IC gets closer to the PCB, and hence the thermal inductance can be improved by a factor between 2 and 3.…
Microchip Technologies has introduced a new high-performance Miniature Atomic Clock (MAC) called MAC-SA5X that can produce a stable time and frequency reference to maintain a high degree of synchronization with a reference clock, such as a GNSS-derived signal. Further, the new device can deliver a wider thermal range and rapid warm-up time which improves the critical…
CUI Devices has announced the addition of two new Peltier Cooling Units namely the CPM-2C and CPM-2H to its existing thermoelectric cooling modules. These two new modules have a higher current rating of 7A and 8.5A respectively, compared to the existing CPM-2F modules which operate on 6A. This higher current provides a wide temperature delta (temperature difference between…
Murata has successfully commercialized the world’s smallest PTC thermistor (resettable fuse) with part number PRG03BC181QB6RL, in a 0201-inch size (0.6 x 0.3 x 0.3mm) package targeted for mobile devices. With an operating temperature from -20 deg C to 60 deg C the new PTC can provide excellent long term stability in high-temperature environments.
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The Optoelectronics group of Vishay Intertechnology has introduced two new fully integrated proximity sensors namely VCNL36821S and VCNL36826S. Each sensor features an IR emitter and a vertical-cavity surface-emitting laser (VCSEL) respectively. The device combines a photodiode, signal processing IC, and 12-bit ADC in a compact 2.55 mm by 2.05 mm by 1.0 mm surface-mount…
Power Integrations has introduced the AEC-Q100 automotive-qualified SID1181KQ SCALE-iDriver gate driver for 750 V-rated IGBTs. The new driver IC is compact, efficient and highly robust, and it uses high-speed FluxLink communication technology to ensure system safety in various critical conditions. The FluxLink communication technology replaces the Optocouplers and capacitive…
Ethernet is becoming more common in spacecraft to enable hardwired communication speed, support higher data rates, and facilitate interoperability between satellites and other spacecraft. As Ethernet in space applications continues to expand, Microchip announced the space-qualified Ethernet transceiver – a radiation-tolerant device based on a Commercial Off-the-…
Semtech Corporation has launched the AVX200T, AVX chipset for multimedia connectivity over both copper category cabling and optical fiber. The AVX200T flagship part offers unprecedented levels of performance for AV extension applications such as standalone point-to-point cable extenders, matrix switches, and KVM extension.
AVX200T is designed with a…
Renesas Electronics Corporation introduced a highly integrated Power Management IC (PMIC), ISL78083 that simplifies power supply design HD camera modules by reducing the development cycle, bill of materials (BOM) cost, and supply chain risks. The PMIC can accept the power from a battery (36V- 42V) or power-over-coax (15-18V) supply sources and supports output currents up to…
Infineon Technologies has collaborated with software and 3D Time of Flight system specialists, pmdtechnologies to develop the world’s smallest (4.4 x 5.1mm) at the same time the most powerful 3D image sensor. The REAL 3 single-chip solution can provide the highest resolution data with low power consumption and it can be incorporated even into the smallest devices with just a…