Infineon Technologies, has launched its latest high-density power modules designed to support AI and high-performance computing. The new TDM2454xx quad-phase power modules offer power density and enhanced energy efficiency, making them an ideal solution for AI-driven data centers.
Most traditional power delivery systems rely on horizontal power flow, which increases resistance and leads to energy loss. Infineon’s TDM2454xx power modules deliver power with Vertical Power Delivery (VPD). Instead of making power travel across the chip, which causes energy loss, VPD shortens the path, this improves the efficiency and performance. This means data centers can run more reliably while keeping costs down.
These modules are packed with power density of 2A per mm² and handling up to 280A across four phases. Designed especially for AI workloads, they come in an integrated embedded capacitor layer within a compact 10x9mm² form factor, providing the most robust power solution with improved system power density.
Infineon’s OptiMOS 6 trench technology ensures strong electrical and thermal performance, while an integrated capacitor layer boosts power stability for high-performance computing. By combining advanced packaging, better thermal management, and Infineon’s XDP controllers, the TDM2454xx series delivers powerful and energy-efficient performance.
As AI-driven computing continues to grow, these modules will help data centers handle the rising power demands in the industry, while reducing energy waste.
