Ultra-Compact Automotive-Grade MOSFETs Provide Superior Mounting Reliability

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ByAbhiemanyu Pandit 0

Ultra-Compact Automotive-Grade MOSFETs Provide Superior Mounting Reliability

ROHM announced the development of ultra-compact 1.6x1.6mm size MOSFETs that deliver superior mounting reliability. The ROHM’s RV4xxx series offers Proprietary Wettable Flank technology which guarantees a minimum solder height of just 130μm and the technology involves making a step cut into the lead frame on the side of the package before plating. Also, the RV4xxx series contributes to longer application operation by reducing standby current consumption. The devices is AEC-Q101 qualified which ensures its application in automotive domain with automotive-grade reliability and performance under extreme conditions. The MOSFET’s enable greater miniaturization in automotive devices such as ADAS camera modules.

 

The Wettable Flank Technology used in RV4xxx series increases the solder joint surface between the package and substrate, improving solder wettability to allow easy verification of solder condition after mounting. The Wettable Flank formation technology also result in consistent solder quality – even for compact products – enabling automatic inspection machines to easily verify solder conditions after mounting. 

 

Features of RV4xxx series:

  • Ultra-compact 1.6x1.6mm size
  • AEC-Q101 qualified
  • Comes with a minimum solder height of just 130μm
  • Reduced standby current consumption
  • Power Consumption = 0.6W
  • Package: DFN1616

 

Device Specification Table:

Part No.

Polarity [ch]

Drain-Source Voltage VDSS [V]

Drain Current ID [A]

Drive Voltage [V]

Drain-Source ON Resistance

RDS(ON)[mΩ]@VGS=10V

RDS(ON)[mΩ]@VGS=4.0V

RDS(ON)[mΩ]@VGS=2.5V

RDS(ON)[mΩ]@VGS=1.8V

RDS(ON)[mΩ]
@VGS=1.5V

Typ.

Max.

Typ.

Max.

Typ.

Max.

Typ.

Max.

Typ.

Max.

RV4E031RP

P

30

3.1

4.0

75

101

108

151

RV4C020ZP

P

20

2.0

2.5

260

360

340

470

420

580

 

The samples of RV4xxx series is available now and OEM quantities will be available in coming September 2019.

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