New Precision MEMS Sensor Supports Accurate Positioning and Control for Cars

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ASM330LHH an Automotive 6-axial inertial module introduced by STMicroelectronics

STMicroelectronics introduces ASM330LHH integrated with 3D digital accelerometer and 3D digital gyroscope, provides super-high-resolution motion tracking in advanced vehicle navigation and telematics applications. With advancement in telematics, low noise and extended temperature range (upto +105℃), it enables dependable telematics services which is helpful when the satellite signals gets blocked due to highly dense and covered areas like forests, tunnels, and urban canyons. The six axial inertial data allows the sensor in offering advanced automated-driving system. All the manufacturing, designing, fabricating, testing, calibrating and supplying process is owned by STMicroelectronics. Some of the technical features of ASM330LHH are given below:

Further technical information on the ASM330LHH:

  • Temperature range up 105°C giving designers extra freedom to locate electronic controls in hot areas such as in smart antennas on the vehicle roof, or near the engine compartment;
  • Ultra-low noise allows greater measurement resolution by minimizing integration errors when positioning is reliant on sensors only;
  • High linearity and built-in temperature compensation eliminate any need for external compensation algorithms over its operating range;
  • Lowest power consumption in class, with features for optimizing power management if battery usage becomes crucial;
  • Qualified according to AEC-Q100 automotive-grade robustness standard;
  • Built on ST’s proven, proprietary ThELMA[2] MEMS process technology, which enables integration of both the 3-axis accelerometer and 3-axis angular-rate sensor (gyroscope) on the same silicon for optimum yield, quality, and reliability;
  • The electronic interface integrates the signal chain for both sensors on a single die using ST’s 130nm HCMOS9A technology;
  • Reference designs, as well as ST’s Teseo™ satellite-positioning modules and related software are available. The dead-reckoning algorithm included with the Teseo III GNSS-receiver chipset already supports the ASM330LHH to generate a high-accuracy output suitable for autonomous navigation;
  • Tiny, low-profile 3mm x 2.5mm x 0.83mm device for minimal impact on the size of any on-board module;
  • Packaged as a leadless Land Grid Array (LGA) device.

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